ADSP-BF702KCPZ-3
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- Mfr.Part #
- ADSP-BF702KCPZ-3
- Manufacturer
- Analog Devices, Inc.
- Package / Case
- 88-VFQFN Exposed Pad, CSP
- Datasheet
- Download
- Description
- IC DSP LP 256KB L2SR 88LFCSP
- Stock
- 16,360
- In Stock ：
- 16,360
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- Manufacturer :
- Analog Devices, Inc.
- Product Category :
- DSP (Digital Signal Processors)
- Lead Free :
- Contains Lead
- Type :
- Blackfin+
- Internal Bus Architecture :
- Multiple
- Number of Pins :
- 88
- Supply Voltage-Min (Vsup) :
- 1.7V
- Additional Feature :
- IT ALSO OPERATES AT 3.3V NOM SUPPLY
- Non-Volatile Memory :
- ROM (512kB)
- Packaging :
- Tray
- JESD-609 Code :
- e3
- Pbfree Code :
- No
- RoHS Status :
- ROHS3 Compliant
- Factory Lead Time :
- 8 Weeks
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Boundary Scan :
- yes
- Voltage - I/O :
- 1.8V 3.3V
- Format :
- FIXED POINT
- Supply Voltage :
- 1.8V
- Package / Case :
- 88-VFQFN Exposed Pad, CSP
- Terminal Pitch :
- 0.5mm
- Interface :
- CAN, DSPI, EBI/EMI, I2C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG
- Height Seated (Max) :
- 0.9mm
- Base Part Number :
- ADSP-BF702
- Terminal Position :
- QUAD
- Terminal Form :
- NO LEAD
- Peak Reflow Temperature (Cel) :
- 260
- Number of Terminations :
- 88
- Number of UART Channels :
- 2
- Barrel Shifter :
- yes
- RAM Size :
- 256KB
- Frequency :
- 300MHz
- Mount :
- Surface Mount
- Terminal Finish :
- Matte Tin (Sn)
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Operating Temperature :
- 0°C~70°C TA
- Memory Size :
- 512kB
- Supply Voltage-Max (Vsup) :
- 1.9V
- Low Power Mode :
- yes
- Series :
- Blackfin®
- Pin Count :
- 88
- Voltage - Core :
- 1.10V
- Lifecycle Status :
- Production (Last Updated: 1 month ago)
- Mounting Type :
- Surface Mount
- Datasheets
- ADSP-BF702KCPZ-3
DSP Analog Devices, Inc. ADSP-BF702KCPZ-3 Overview
The ADSP-BF702KCPZ-3 from Analog Devices, Inc. represents a sophisticated addition to the world of digital signal processors. This low-power IC is engineered to handle complex digital signal processing with remarkable efficiency and reliability. Featuring 256KB of L2 SRAM, the device is encapsulated in an 88-lead LFCSP (Lead Frame Chip Scale Package), ensuring a compact footprint while providing robust performance capabilities. This makes the DSP Analog Devices, Inc. ADSP-BF702KCPZ-3 an ideal choice for applications requiring intensive processing power in a small form factor. It is particularly suited for energy-sensitive projects where maintaining a balance between power and performance is crucial.
ADSP-BF702KCPZ-3 Features
The ADSP-BF702KCPZ-3 boasts several key features that enhance its utility in digital signal processing. It includes an advanced processor core that delivers powerful computational speeds while maintaining low power consumption. The integration of 256KB L2 SRAM allows for swift data access and storage, facilitating efficient task execution. Additionally, the compact 88-lead LFCSP packaging not only saves space but also contributes to improved thermal management and reduced system complexity.
ADSP-BF702KCPZ-3 Applications
- Automotive Audio Systems: Used in the signal processing chain to manage and enhance audio signals, providing superior sound quality and system reliability.
- Portable Medical Devices: Employs its signal processing capabilities to interpret and analyze biomedical signals, ensuring accurate and timely medical readings.
- Industrial Control Systems: Enhances the precision and efficiency of control algorithms, vital for the automation of complex industrial processes.
- Communication Infrastructure: Critical in managing and optimizing the signal processing required for data transmission and reception, supporting robust communication networks.
- Consumer Electronics: Utilized in devices such as digital cameras and home entertainment systems to process audio and visual data, enhancing user experience.
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