ADSP-BF700KCPZ-1
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- Mfr.Part #
- ADSP-BF700KCPZ-1
- Manufacturer
- Analog Devices, Inc.
- Package / Case
- 88-VFQFN Exposed Pad, CSP
- Datasheet
- Download
- Description
- IC DSP LP 128KB L2SR 88LFCSP
- Stock
- 1,584
- In Stock ：
- 1,584
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- Manufacturer :
- Analog Devices, Inc.
- Product Category :
- DSP (Digital Signal Processors)
- Frequency :
- 100MHz
- Lifecycle Status :
- Production (Last Updated: 1 month ago)
- Supply Voltage-Min (Vsup) :
- 1.7V
- Format :
- FIXED POINT
- Boundary Scan :
- yes
- RAM Size :
- 128kB
- Factory Lead Time :
- 8 Weeks
- Peak Reflow Temperature (Cel) :
- 260
- Height Seated (Max) :
- 0.9mm
- Mount :
- Surface Mount
- Voltage - Core :
- 1.10V
- Type :
- Blackfin+
- Memory Size :
- 512kB
- Terminal Position :
- QUAD
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Additional Feature :
- IT ALSO OPERATES AT 3.3V NOM SUPPLY
- Interface :
- CAN, DSPI, EBI/EMI, I2C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG
- Packaging :
- Tray
- RoHS Status :
- ROHS3 Compliant
- Barrel Shifter :
- yes
- Terminal Finish :
- Matte Tin (Sn)
- Number of UART Channels :
- 2
- Pbfree Code :
- No
- Number of Terminations :
- 88
- Operating Temperature :
- 0°C~70°C TA
- Non-Volatile Memory :
- ROM (512kB)
- Internal Bus Architecture :
- Multiple
- Terminal Pitch :
- 0.5mm
- Lead Free :
- Contains Lead
- Base Part Number :
- ADSP-BF700
- Low Power Mode :
- yes
- Mounting Type :
- Surface Mount
- Terminal Form :
- NO LEAD
- JESD-609 Code :
- e3
- Series :
- Blackfin®
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of Pins :
- 88
- Supply Voltage :
- 1.8V
- Pin Count :
- 88
- Package / Case :
- 88-VFQFN Exposed Pad, CSP
- Supply Voltage-Max (Vsup) :
- 1.9V
- Voltage - I/O :
- 1.8V 3.3V
- Datasheets
- ADSP-BF700KCPZ-1
DSP Analog Devices, Inc. ADSP-BF700KCPZ-1 Overview
The DSP Analog Devices, Inc. ADSP-BF700KCPZ-1 is a high-performance digital signal processor designed to address the complex demands of embedded applications requiring efficient, real-time signal processing. This processor integrates 128KB of L2 SRAM, offering a balance of power and performance that is ideal for space-constrained applications. Its low-power consumption and small footprint in an 88-lead LFCSP (Lead Frame Chip Scale Package) make it particularly suitable for portable devices where energy efficiency and board space are critical considerations.
ADSP-BF700KCPZ-1 Features
- Low power consumption, making it ideal for battery-powered devices.
- 128 KB of on-chip L2 SRAM provides substantial memory for real-time processing without external components.
- Advanced 88-LFCSP packaging ensures minimal space usage with maximum reliability.
- High degree of integration supports streamlined product development cycles.
ADSP-BF700KCPZ-1 Applications
- Audio Processing: Utilized in devices such as digital hearing aids and Bluetooth audio systems, where its DSP capabilities enable superior sound quality and advanced audio features.
- Industrial Control Systems: Supports complex algorithm computations for real-time automation controls, improving operational efficiency and response times in manufacturing settings.
- Medical Devices: Critical for portable medical diagnostics equipment, where it processes complex signals to deliver real-time analysis for patient monitoring.
- Automotive Systems: Used in vehicle systems for real-time sensor data processing, enhancing safety features like adaptive cruise control and collision avoidance systems.
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