ADSP-BF700BCPZ-2

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Mfr.Part #
ADSP-BF700BCPZ-2
Manufacturer
Analog Devices, Inc.
Package / Case
88-VFQFN Exposed Pad, CSP
Datasheet
Download
Description
IC DSP LP 128KB L2SR 88LFCSP
Stock
242
In Stock :
242

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Manufacturer :
Analog Devices, Inc.
Product Category :
DSP (Digital Signal Processors)
RoHS Status :
ROHS3 Compliant
Base Part Number :
ADSP-BF700
Additional Feature :
IT ALSO OPERATES AT 3.3V NOM SUPPLY
Supply Voltage-Max (Vsup) :
1.9V
Height Seated (Max) :
0.9mm
Boundary Scan :
yes
Type :
Blackfin+
Supply Voltage :
1.8V
Internal Bus Architecture :
Multiple
Number of Pins :
88
Interface :
CAN, DSPI, EBI/EMI, I2C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG
Mount :
Surface Mount
Packaging :
Tray
Non-Volatile Memory :
ROM (512kB)
Terminal Pitch :
0.5mm
Memory Size :
512kB
JESD-609 Code :
e3
Number of Terminations :
88
RAM Size :
128kB
Barrel Shifter :
yes
Format :
FIXED POINT
Lead Free :
Contains Lead
Terminal Form :
NO LEAD
Supply Voltage-Min (Vsup) :
1.7V
Time@Peak Reflow Temperature-Max (s) :
30
Voltage - Core :
1.10V
Pin Count :
88
Frequency :
200MHz
Peak Reflow Temperature (Cel) :
260
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Pbfree Code :
No
Package / Case :
88-VFQFN Exposed Pad, CSP
Factory Lead Time :
12 Weeks
Number of UART Channels :
2
Terminal Position :
QUAD
Terminal Finish :
Matte Tin (Sn)
Low Power Mode :
yes
Operating Temperature :
-40°C~85°C TA
Mounting Type :
Surface Mount
Voltage - I/O :
1.8V 3.3V
Series :
Blackfin®
Lifecycle Status :
Production (Last Updated: 1 month ago)
Datasheets
ADSP-BF700BCPZ-2
Introducing DSP (Digital Signal Processors) Analog Devices, Inc. ADSP-BF700BCPZ-2 from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:ADSP-BF700, Type:Blackfin+, Number of Pins:88, Number of Terminations:88, Package / Case:88-VFQFN Exposed Pad, CSP, Operating Temperature:-40°C~85°C TA, Mounting Type:Surface Mount, ADSP-BF700BCPZ-2 pinout, ADSP-BF700BCPZ-2 datasheet PDF, ADSP-BF700BCPZ-2 amp .Beyond DSP (Digital Signal Processors) Analog Devices, Inc. ADSP-BF700BCPZ-2 ,we also offer TMS320VC5416PGE160, TMS320C6713BZDP300, ADSP-21369KBPZ-3A, Our vast inventory has you covered. Contact us now for immediate solutions.

Analog Devices, Inc. ADSP-BF700BCPZ-2


DSP Analog Devices, Inc. ADSP-BF700BCPZ-2 Overview

The ADSP-BF700BCPZ-2 by Analog Devices, Inc. is a state-of-the-art digital signal processor that exemplifies cutting-edge technology in DSP engineering. This product is specifically designed to meet the demanding needs of low-power, high-performance applications across various industries. The IC DSP LP 128KB L2SR 88LFCSP configuration integrates advanced features with robust security options, making it a preferred choice for developers aiming for efficiency and scalability in their digital signal processing tasks. Utilizing the DSP Analog Devices, Inc. ADSP-BF700BCPZ-2 in your designs ensures a compact, reliable, and powerful component that enhances overall system performance.

ADSP-BF700BCPZ-2 Features

This digital signal processor boasts an array of impressive features that cater to a wide range of applications. Key features include its low-power consumption and 128 KB of L2 SRAM, which provide a perfect balance between power efficiency and data processing capability. The 88-lead LFCSP (Lead Frame Chip Scale Package) ensures a compact footprint along with enhanced thermal management and reliability under stress. This DSP is ideal for applications requiring intensive signal processing capabilities with constrained power budgets.

ADSP-BF700BCPZ-2 Applications

  • Automotive Audio Systems: Utilized in advanced audio processing units for vehicles to enhance sound quality and provide robust noise cancellation.
  • Home Automation: Serves as the processing core in smart home devices, enabling sophisticated control algorithms and connectivity with other smart devices.
  • Medical Imaging: Applied in medical diagnostic equipment where precision and efficiency in processing large volumes of imaging data are crucial.
  • Wireless Communication Systems: Helps manage signal integrity and processing for both base station and mobile units in complex communication infrastructures.
  • Industrial Control Systems: Enhances processing capabilities of automated control systems in manufacturing processes, ensuring higher precision and reliability.
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