A3P600-2FG256

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Mfr.Part #
A3P600-2FG256
Manufacturer
Microchip Technology
Package / Case
256-LBGA
Datasheet
Download
Description
IC FPGA 177 I/O 256FBGA
Stock
28,767
In Stock :
28,767

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Manufacturer :
Microchip Technology
Product Category :
FPGAs (Field Programmable Gate Array)
Weight :
400.011771mg
RAM Size :
13.5kB
Package / Case :
256-LBGA
Min Operating Temperature :
0°C
Lifecycle Status :
IN PRODUCTION (Last Updated: 1 month ago)
Base Part Number :
A3P600
Max Frequency :
310MHz
Factory Lead Time :
12 Weeks
Total RAM Bits :
110592
Voltage - Supply :
1.425V~1.575V
Max Supply Voltage :
1.575V
Number of Registers :
13824
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Mount :
Surface Mount
Published :
2009
RoHS Status :
Non-RoHS Compliant
Number of Gates :
600000
Mounting Type :
Surface Mount
Number of Pins :
256
Min Supply Voltage :
1.425V
Max Operating Temperature :
70°C
Width :
17mm
Operating Supply Voltage :
1.5V
Operating Temperature :
0°C~85°C TJ
Length :
17mm
Number of I/O :
177
Radiation Hardening :
No
Speed Grade :
2
Height :
1.2mm
Supplier Device Package :
256-FPBGA (17x17)
Series :
ProASIC3
Packaging :
Tray
Datasheets
A3P600-2FG256
Introducing FPGAs (Field Programmable Gate Array) Microchip Technology A3P600-2FG256 from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:256-LBGA, Base Part Number:A3P600, Mounting Type:Surface Mount, Number of Pins:256, Operating Temperature:0°C~85°C TJ, A3P600-2FG256 pinout, A3P600-2FG256 datasheet PDF, A3P600-2FG256 amp .Beyond FPGAs (Field Programmable Gate Array) Microchip Technology A3P600-2FG256 ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology A3P600-2FG256


FPGAs Microchip Technology A3P600-2FG256 Overview

The FPGAs Microchip Technology A3P600-2FG256 represents a high-performance, configurable FPGA device tailored to meet the rigorous demands of modern digital circuits. This device is crafted by Microchip Technology, a leader in semiconductor innovation, providing advanced solutions for a myriad of applications. The A3P600-2FG256 is specifically designed to offer a flexible and efficient platform for developing complex designs in a compact 256FBGA package, making it ideal for applications where space and power efficiency are critical. With 177 I/O pins, this FPGA provides ample connectivity for interfacing with a wide range of peripherals and other ICs, supporting versatile and dynamic system configurations.

A3P600-2FG256 Features

This FPGA boasts a robust set of features that make it a versatile choice for designers and engineers. Key features include its 256FBGA packaging that ensures a minimal footprint while allowing for substantial functionality and connectivity. Additionally, its substantial I/O capabilities facilitate complex, multi-functional system designs. The A3P600-2FG256 is also characterized by its programmable nature, allowing for reconfiguration and updates post-deployment, which is essential for iterative development and long-term product sustainability.

A3P600-2FG256 Applications

  • Consumer Electronics: Used in devices such as smartphones and tablets, the A3P600-2FG256 allows for rapid reprogramming and adaptation to evolving consumer needs and software updates.
  • Automotive Applications: Integrates into automotive systems for control and processing applications, enhancing vehicle performance and safety features through its high I/O count and programmability.
  • Industrial Automation: Plays a crucial role in programmable logic controllers and industrial interfaces, where adaptability and reliability are paramount, enhancing operational efficiency and system responsiveness.
  • Telecommunications: Utilized in communication infrastructure equipment, supporting complex signal processing tasks and providing the flexibility needed for network expansions and upgrades.
  • Medical Devices: Contributes to the functionality of medical imaging and diagnostic equipment, where precision and reliability are critical, by enabling complex logic implementations and real-time processing capabilities.
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