A2F200M3F-1FG256
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- Mfr.Part #
- A2F200M3F-1FG256
- Manufacturer
- Microchip Technology
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 100MHZ 256FBGA
- Stock
- 21,984
- In Stock ：
- 21,984
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Supply Voltage-Min (Vsup) :
- 1.425V
- Factory Lead Time :
- 12 Weeks
- Surface Mount :
- yes
- Number of Gates :
- 200000
- Height Seated (Max) :
- 1.7mm
- Radiation Hardening :
- No
- Peak Reflow Temperature (Cel) :
- 225
- JESD-609 Code :
- e0
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Position :
- BOTTOM
- Terminal Pitch :
- 1mm
- Number of Pins :
- 256
- Series :
- SmartFusion®
- Operating Supply Current :
- 3mA
- Number of Outputs :
- 66
- Published :
- 2009
- Base Part Number :
- A2F200
- Length :
- 17mm
- Number of Logic Blocks (LABs) :
- 8
- Time@Peak Reflow Temperature-Max (s) :
- 20
- Operating Temperature :
- -40°C~100°C TJ
- Number of I/O :
- MCU - 25, FPGA - 66
- Peripherals :
- DMA, POR, WDT
- Core Architecture :
- ARM
- RoHS Status :
- Non-RoHS Compliant
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- RAM Size :
- 64KB
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Core Processor :
- ARM® Cortex®-M3
- Number of Terminations :
- 256
- Flash Size :
- 256KB
- Interface :
- EBI/EMI, Ethernet, I2C, SPI, UART, USART
- Primary Attributes :
- ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
- Width :
- 17mm
- Terminal Form :
- Ball
- Supply Voltage :
- 1.5V
- Supply Voltage-Max (Vsup) :
- 1.575V
- Architecture :
- MCU, FPGA
- Packaging :
- Tray
- Frequency :
- 100MHz
- Package / Case :
- 256-LBGA
- Datasheets
- A2F200M3F-1FG256
256 Terminations -40°C~100°C TJ 256 Pin A2F200 System On Chip SmartFusion® Series MCU - 25, FPGA - 66 I/O 1.5V
This SoC is built on ARM® Cortex®-M3 core processor(s).
ARM® Cortex®-M3 core processor(s) are used in the construction of this SoC.Manufacturer assigns package 256-LBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the SmartFusion® series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has MCU - 25, FPGA - 66 I/Os.Use a power supply with a voltage of 1.5V if possible.It is unsafe to operate the SoCs wireless at voltages above 1.575V.Power supplies of at least 1.425V are required.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.A system on a chip benefits from having 256 terminations.A SoC chip like this can have 66 outputs.A flashing 256KB appears on it.Searching A2F200 will bring up system on chips with similar specs and purposes.At 100MHz, the wireless SoC works.In this SoC meaning, ARM serves as the core architecture.The computer SoC is the 256-pin version.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F200M3F-1FG256I System On Chip (SoC) applications.
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
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