A2F060M3E-CS288I
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- Mfr.Part #
- A2F060M3E-CS288I
- Manufacturer
- Microsemi
- Package / Case
- 288-TFBGA, CSPBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 80MHZ 288CSP
- Stock
- 39,466
- In Stock ：
- 39,466
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- Manufacturer :
- Microsemi
- Product Category :
- System On Chip (SoC)
- Qualification Status :
- Not Qualified
- Terminal Position :
- BOTTOM
- Architecture :
- MCU, FPGA
- Frequency :
- 80MHz
- Organization :
- 1536 CLBS, 60000 GATES
- Number of Inputs :
- 68
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Base Part Number :
- A2F060M3E
- Number of Logic Blocks (LABs) :
- 8
- Number of Terminations :
- 288
- Supply Voltage :
- 1.5V
- Flash Size :
- 128kB
- Width :
- 11mm
- Number of I/O :
- MCU - 28, FPGA - 68
- Number of Equivalent Gates :
- 60000
- Terminal Form :
- Ball
- Terminal Pitch :
- 0.5mm
- Connectivity :
- EBI/EMI, I2C, SPI, UART/USART
- JESD-609 Code :
- e0
- Supply Voltage-Min (Vsup) :
- 1.425V
- Series :
- SmartFusion®
- Package / Case :
- 288-TFBGA, CSPBGA
- Interface :
- EBI/EMI, I2C, SPI, UART, USART
- Terminal Finish :
- Tin/Lead/Silver (Sn/Pb/Ag)
- Core Processor :
- ARM® Cortex®-M3
- Height Seated (Max) :
- 1.05mm
- Supply Voltage-Max (Vsup) :
- 1.575V
- Operating Temperature :
- -40°C~100°C TJ
- Primary Attributes :
- ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
- Time@Peak Reflow Temperature-Max (s) :
- 20
- Published :
- 2015
- Packaging :
- Tray
- Factory Lead Time :
- 12 Weeks
- Number of Outputs :
- 68
- RAM Size :
- 16kB
- Peak Reflow Temperature (Cel) :
- 235
- Length :
- 11mm
- Surface Mount :
- yes
- RoHS Status :
- Non-RoHS Compliant
- Core Architecture :
- ARM
- Peripherals :
- DMA, POR, WDT
- Datasheets
- A2F060M3E-CS288I
288 Terminations -40°C~100°C TJ A2F060M3E System On Chip SmartFusion® Series MCU - 28, FPGA - 68 I/O 1.5V
This SoC is built on ARM® Cortex®-M3 core processor(s).
A core processor ARM® Cortex®-M3 is used to build this SoC.Its package is 288-TFBGA, CSPBGA.A 16KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the SmartFusion® series.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.A key point to note is that this SoC security combines ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are MCU - 28, FPGA - 68.A 1.5V power supply should be used.There are voltages higher than 1.575V that should be avoided when using the SoCs wireless.There is a possibility that it can be powered by a power supply of at least 1.425V.The FIELD PROGRAMMABLE GATE ARRAY can be configured to meet different design requirements.Having 288 terminations in total makes system on a chip possible.It is possible to use this SoC chip with 68 outputs.A SoC chip with 68 inputs is available to the user.There is a flash of 128KB.Searching A2F060M3E will yield system on chips with similar specs and purposes.80MHz is the wireless SoC's frequency.Based on the core architecture of ARM, the SoC meaning has a high level of performance.
ARM® Cortex®-M3 processor.
16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F060M3E-CS288I System On Chip (SoC) applications.
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
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