93LC66AT/ST
- Mfr.Part #
- 93LC66AT/ST
- Manufacturer
- Microchip Technology
- Package / Case
- 8-TSSOP (0.173, 4.40mm Width)
- Datasheet
- Download
- Description
- IC EEPROM 4KBIT SPI 2MHZ 8TSSOP
- Stock
- 27,327
- In Stock :
- 27,327
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- Manufacturer :
- Microchip Technology
- Product Category :
- Memory
- Series :
- --
- Lead Free :
- Lead Free
- Standby Current-Max :
- 0.000001A
- Memory Interface :
- SPI
- Product Category :
- EEPROM
- Power Supplies :
- 3/5V
- Packaging :
- Tape and Reel (TR)
- Height :
- 1 mm
- Endurance :
- 1000000 Write/Erase Cycles
- Mounting Style :
- SMD/SMT
- Data Retention :
- 200 Year
- Interface Type :
- 3-Wire, Microwire
- Nominal Supply Current :
- 1.5mA
- Terminal Position :
- Dual
- Interfaces :
- Serial(Microwire)
- ECCN Code :
- EAR99
- Base Part Number :
- 93LC66A
- Mount :
- Surface Mount
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Length :
- 4.4mm
- Supply Voltage :
- 3V
- Published :
- 2000
- Access Time :
- 6 ms
- Interface :
- 2-Wire, Serial
- Minimum Operating Temperature :
- 0 C
- Write Protection :
- SOFTWARE
- Pin Count :
- 8
- Width :
- 3mm
- Supply Voltage-Min (Vsup) :
- 2.5V
- Mounting Type :
- Surface Mount
- RoHS Status :
- ROHS3 Compliant
- Memory Size :
- 4Kb 512 x 8
- Data Retention Time-Min :
- 200
- Write Cycle Time - Word, Page :
- 6ms
- Product Type :
- EEPROM
- Number of Functions :
- 1
- Height Seated (Max) :
- 1.1mm
- Organization :
- 512 x 8
- Radiation Hardening :
- No
- Operating Temperature :
- 0°C~70°C TA
- Density :
- 4 kb
- Package :
- Tape and Reel (TR)
- Memory Type :
- Non-Volatile
- Additional Feature :
- 1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS
- Product Status :
- Active
- Peak Reflow Temperature (Cel) :
- 260
- Memory Width :
- 8
- Brand :
- Microchip Technology
- JESD-609 Code :
- e3
- Subcategory :
- Memory and Data Storage
- Base Product Number :
- 93LC66
- Maximum Operating Temperature :
- + 70 C
- Pbfree Code :
- yes
- Clock Frequency :
- 2MHz
- Terminal Pitch :
- 0.65mm
- Memory Density :
- 4
- Voltage - Supply :
- 2.5V~5.5V
- Operating Supply Voltage :
- 5.5V
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Manufacturer :
- Microchip
- Package / Case :
- 8-TSSOP (0.173, 4.40mm Width)
- Serial Bus Type :
- Microwire
- Supply Voltage-Max (Vsup) :
- 6V
- RoHS :
- Details
- Supplier Device Package :
- 8-TSSOP
- Contact Plating :
- Tin
- Programming Voltage :
- 2.5 V to 6 V
- Memory Format :
- EEPROM
- Number of Pins :
- 8
- Operating Supply Current :
- 1.5 mA
- Memory Organization :
- 512 x 8
- Factory Lead Time :
- 6 Weeks
- Number of Terminations :
- 8
- Datasheets
- 93LC66AT/ST
Memory Microchip Technology 93LC66AT/ST Overview
Introducing the cutting-edge 93LC66AT/ST EEPROM from Microchip Technology, a pioneer in integrated circuit solutions. This sophisticated EEPROM boasts a capacity of 4KBIT, offering ample storage space for your critical data. Designed with SPI interface, it delivers swift data transfer rates of up to 2MHZ, ensuring efficient performance in demanding applications. Encased in an 8TSSOP package, it ensures easy integration into your systems, saving both space and effort.
93LC66AT/ST Features
- 4KBIT capacity for extensive data storage
- SPI interface for high-speed data transfer up to 2MHZ
- Compact 8TSSOP package for easy integration
- Robust EEPROM technology for reliable data retention
- Low power consumption for energy-efficient operation
- Wide operating voltage range for versatile compatibility
93LC66AT/ST Applications
- Industrial Automation: Utilize the 93LC66AT/ST EEPROM in industrial automation systems for storing configuration settings, calibration data, and event logs, ensuring seamless operation and maintenance.
- Embedded Systems: Incorporate the 93LC66AT/ST EEPROM into embedded systems for storing firmware, user preferences, and sensor data, enabling efficient boot-up and system customization.
- Consumer Electronics: Integrate the 93LC66AT/ST EEPROM into consumer electronics such as smart appliances and IoT devices for data logging, device configuration, and firmware updates, enhancing user experience and functionality.
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