74HCT7030D,112

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Mfr.Part #
74HCT7030D,112
Manufacturer
NXP Semiconductors
Package / Case
28-SOIC (0.295, 7.50mm Width)
Datasheet
Download
Description
IC 9X64 FIFO REGISTER 3ST 28SOIC
Stock
42,185
In Stock :
42,185

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Manufacturer :
NXP Semiconductors
Product Category :
FIFOs Memory
Published :
1997
Additional Feature :
REGISTER BASED; BUBBLE BACK 3US
Terminal Position :
Dual
RoHS Status :
ROHS3 Compliant
HTS Code :
8542.39.00.01
Time@Peak Reflow Temperature-Max (s) :
30
Supply Voltage-Max (Vsup) :
5.5V
Supply Voltage-Min (Vsup) :
4.5V
JESD-609 Code :
e4
Bus Directional :
Uni-Directional
Memory Density :
576 bit
Terminal Form :
Gull wing
Access Time :
40ns
Cycle Time :
116.28 ns
Parallel/Serial :
Parallel
Length :
17.9mm
Mounting Type :
Surface Mount
Output Characteristics :
3-STATE
Memory Size :
576 64 x 9
Peak Reflow Temperature (Cel) :
260
Organization :
64X9
Clock Frequency :
10MHz
Supply Voltage :
5V
Operating Temperature :
-40°C~125°C
Series :
74HCT
Base Part Number :
74HCT7030
Height Seated (Max) :
2.65mm
FWFT Support :
No
Memory Width :
9
Width :
7.5mm
Function :
Asynchronous, Synchronous
Packaging :
Tube
Output Enable :
yes
Voltage - Supply :
4.5V~5.5V
Power Supplies :
5V
Terminal Finish :
NICKEL PALLADIUM GOLD
Number of Terminations :
28
Memory IC Type :
OTHER FIFO
Surface Mount :
yes
Package / Case :
28-SOIC (0.295, 7.50mm Width)
JESD-30 Code :
R-PDSO-G28
Expansion Type :
Depth, Width
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Data Rate :
29MHz
Terminal Pitch :
1.27mm
Datasheets
74HCT7030D,112
Introducing FIFOs Memory NXP Semiconductors 74HCT7030D,112 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:-40°C~125°C, Base Part Number:74HCT7030, Number of Terminations:28, Package / Case:28-SOIC (0.295, 7.50mm Width), 74HCT7030D,112 pinout, 74HCT7030D,112 datasheet PDF, 74HCT7030D,112 amp .Beyond FIFOs Memory NXP Semiconductors 74HCT7030D,112 ,we also offer CY7C433-40JC, SN74ACT7201LA35RJ, SN74ACT7201LA35NP, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors 74HCT7030D,112


FIFOs Memory NXP Semiconductors 74HCT7030D,112 Overview

As a premium product from the reputable NXP Semiconductors, the 74HCT7030D,112 is a top-tier IC 9X64 FIFO register designed for sophisticated electronic applications where data buffering and storage are critical. This FIFO memory device is encased in a 28-pin SOIC package, integrating a three-state 9-bit wide interface capable of handling a 64-word data queue with stellar efficiency and reliability. The 74HCT7030D,112 is crafted for seamless integration into advanced digital systems, offering an exceptional solution for maintaining data coherence across different subsystems. Employing cutting-edge technology, this FIFOs Memory NXP Semiconductors 74HCT7030D,112 chip ensures swift data transmission with minimal latency, making it an ideal choice for high-speed computing and processing tasks demanding swift and orderly data handling.

74HCT7030D,112 Features

  • 3-state outputs for bus-oriented applications
  • 9-bit wide data path for efficient data processing
  • 64-word data storage capacity for ample buffering
  • 28-SOIC package for compact and versatile integration
  • High-speed data flow control to ensure quick data access and transfer
  • Robust construction for increased durability and longevity in demanding environments

74HCT7030D,112 Applications

  • Data Communication Equipment - Assists in buffering data during peak traffic, ensuring smooth and uninterrupted data flow.
  • Industrial Control Systems - Provides reliable data queuing for process monitoring and control.
  • High-speed Computing - Maintains data coherence and sequence in multi-processor systems or during rapid data acquisition.
  • Error Correction Devices - Utilized in mechanisms that require data storage for error analysis and correction.
  • Video Processing Units - Accommodates high-volume, high-speed video data buffering and synchronization.
  • Network Switches and Routers - Helps in managing data packets efficiently, reducing the risk of data collision and packet loss.
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