74HCT245D,652

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Mfr.Part #
74HCT245D,652
Manufacturer
NXP Semiconductors
Package / Case
20-SOIC (0.295, 7.50mm Width)
Datasheet
Download
Description
IC TRANSCVR TRI-ST 8BIT 20SOIC
Stock
8,601
In Stock :
8,601

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Manufacturer :
NXP Semiconductors
Product Category :
Buffers, Drivers, Receivers, Transceivers
Output Type :
3-STATE
Surface Mount :
yes
Number of Pins :
20
Peak Reflow Temperature (Cel) :
260
Voltage - Supply :
4.5V~5.5V
ECCN Code :
EAR99
Pin Count :
20
Load Capacitance :
50pF
Published :
2001
Propagation Delay (tpd) :
33 ns
Terminal Position :
Dual
Width :
7.5mm
Logic Type :
Transceiver, Non-Inverting
Qualification Status :
Not Qualified
Number of Functions :
1
Supply Voltage :
5V
Supply Voltage-Min (Vsup) :
4.5V
Number of Ports :
2
Terminal Form :
Gull wing
Output Polarity :
TRUE
Number of Bits per Element :
8
Base Part Number :
74HCT245
RoHS Status :
ROHS3 Compliant
Family :
HCT
Terminal Finish :
Nickel/Palladium/Gold (Ni/Pd/Au)
Factory Lead Time :
4 Weeks
Time@Peak Reflow Temperature-Max (s) :
30
Supply Voltage-Max (Vsup) :
5.5V
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Number of Terminations :
20
Packaging :
Tube
Additional Feature :
WITH DIRECTION CONTROL
Height Seated (Max) :
2.65mm
Package / Case :
20-SOIC (0.295, 7.50mm Width)
Series :
74HCT
Mounting Type :
Surface Mount
Number of Elements :
1
Operating Temperature :
-40°C~125°C TA
JESD-609 Code :
e4
Current - Output High, Low :
6mA 6mA
Datasheets
74HCT245D,652
Introducing Buffers, Drivers, Receivers, Transceivers NXP Semiconductors 74HCT245D,652 from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:20, Base Part Number:74HCT245, Number of Terminations:20, Package / Case:20-SOIC (0.295, 7.50mm Width), Mounting Type:Surface Mount, Operating Temperature:-40°C~125°C TA, 74HCT245D,652 pinout, 74HCT245D,652 datasheet PDF, 74HCT245D,652 amp .Beyond Buffers, Drivers, Receivers, Transceivers NXP Semiconductors 74HCT245D,652 ,we also offer SN74LVC244APWR, SN74AUP1G07DCKR, SN74LVC2G125DCUR, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors 74HCT245D,652


Buffers, Drivers, Receivers, Transceivers NXP Semiconductors 74HCT245D,652 Overview

Introducing the Buffers, Drivers, Receivers, Transceivers NXP Semiconductors 74HCT245D,652, a high-performance IC transceiver designed for robust digital communication. This device features an 8-bit tri-state bus transceiver architecture, encapsulated in a compact 20-SOIC package, ideal for sophisticated yet space-conscious applications. It supports bidirectional communication and is particularly engineered to facilitate easy and efficient data transfer between buses. The use of advanced silicon technology by NXP Semiconductors ensures that this transceiver provides reliable performance and enhanced functionality, making it an essential component for developers aiming to optimize their digital systems.

74HCT245D,652 Features

The 74HCT245D,652 from NXP Semiconductors is packed with features that enhance its utility and performance in various applications. It supports high-speed data transfer capabilities with a robust tolerance to ambient conditions. Furthermore, its low-power consumption and wide operating voltage range make it suitable for deployment in diverse operational environments. The transceiver's advanced level shifting capabilities allow for interfacing between different logic levels, ensuring versatility across multiple platforms.

74HCT245D,652 Applications

  • Data Communication Equipment: Utilized in servers and routers for efficient data handling and transfer, enhancing connectivity and processing speed.
  • Consumer Electronics: Integrated into consumer electronics such as gaming consoles and TVs to manage digital signals effectively, improving user experience with high-definition outputs.
  • Industrial Control Systems: Applied in automation and control systems, where reliable data transmission is crucial for operational accuracy and safety.
  • Computing Interfaces: Employed in personal computers and peripherals, aiding in robust data exchange between core components and external devices.
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