72V275L20PF8

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Mfr.Part #
72V275L20PF8
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
TQFP
Datasheet
Download
Description
IC FIFO SS 32768X18 20NS 64-TQFP
Stock
45,661
In Stock :
45,661

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
FIFOs Memory
HTS Code :
8542.32.00.71
Contact Plating :
Lead, Tin
Element Configuration :
Dual
Terminal Pitch :
0.8mm
Word Size :
18b
Height Seated (Max) :
1.6mm
Cycle Time :
20 ns
Factory Lead Time :
7 Weeks
RoHS Status :
RoHS Compliant
Lead Free :
Contains Lead
JESD-609 Code :
e0
Memory IC Type :
OTHER FIFO
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Max Supply Current :
60mA
Width :
14mm
Output Enable :
yes
Thickness :
1.4mm
Max Supply Voltage :
3.6V
Temperature Grade :
COMMERCIAL
Bus Directional :
Unidirectional
Frequency (Max) :
50MHz
Number of Pins :
64
Time@Peak Reflow Temperature-Max (s) :
20
Pbfree Code :
No
Operating Supply Voltage :
3.3V
Qualification Status :
Not Qualified
Terminal Form :
Gull wing
Density :
576 kb
Terminal Finish :
Tin/Lead (Sn85Pb15)
Pin Count :
64
Min Supply Voltage :
3V
Sync/Async :
SYNCHRONOUS
Supply Voltage :
3.3V
Mount :
Surface Mount
Package / Case :
TQFP
Length :
14mm
Number of Functions :
1
Peak Reflow Temperature (Cel) :
240
Min Operating Temperature :
0°C
ECCN Code :
EAR99
Frequency :
50MHz
Access Time :
12 ns
Terminal Position :
QUAD
Parallel/Serial :
Parallel
Nominal Supply Current :
60mA
Max Operating Temperature :
70°C
Organization :
32KX18
Published :
2009
Number of Terminations :
64
Standby Current-Max :
0.015A
Retransmit Capability :
yes
Datasheets
72V275L20PF8
Introducing FIFOs Memory Intersil (Renesas Electronics Corporation) 72V275L20PF8 from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:64, Package / Case:TQFP, Number of Terminations:64, 72V275L20PF8 pinout, 72V275L20PF8 datasheet PDF, 72V275L20PF8 amp .Beyond FIFOs Memory Intersil (Renesas Electronics Corporation) 72V275L20PF8 ,we also offer CY7C433-40JC, SN74ACT7201LA35RJ, SN74ACT7201LA35NP, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 72V275L20PF8


[FIFOs Memory Intersil (Renesas Electronics Corporation) 72V275L20PF8] Overview

Introducing the cutting-edge FIFOs Memory solution, engineered by Intersil (Renesas Electronics Corporation) with precision and innovation. The 72V275L20PF8 IC FIFO SS 32768X18 20NS 64TQFP sets the benchmark for seamless data management and rapid information processing. Designed to exceed industry standards, this FIFOs Memory device ensures reliability, efficiency, and unparalleled performance.

With a focus on versatility and adaptability, this product caters to the diverse needs of B2B customers, empowering them with a competitive edge in today's dynamic market landscape. Explore the myriad possibilities and unleash the full potential of your applications with the FIFOs Memory solution from Intersil (Renesas Electronics Corporation).

72V275L20PF8 Features

  • High-Speed Operation: Delivers lightning-fast data processing with a remarkable speed of 20 nanoseconds.
  • Large Capacity: Boasts an impressive storage capacity of 32768X18, ensuring ample space for data storage and retrieval.
  • Robust Design: Built to withstand rigorous industrial environments, guaranteeing durability and longevity.
  • Compact Form Factor: Space-efficient 64-TQFP package facilitates easy integration into various electronic systems.
  • Low Power Consumption: Optimized power efficiency enhances operational performance while minimizing energy consumption.
  • Wide Compatibility: Compatible with a wide range of devices and applications, ensuring seamless integration and interoperability.

72V275L20PF8 Applications

  • Data Communication Systems: Utilized in networking equipment, routers, and switches for efficient data buffering and transmission.
  • Industrial Automation: Integrated into PLCs (Programmable Logic Controllers) and control systems to manage data flow in manufacturing processes.
  • Telecommunications Infrastructure: Deployed in base stations and communication systems for reliable data storage and retrieval in telecommunications networks.
  • Medical Devices: Incorporated into medical imaging equipment and diagnostic devices to handle large volumes of patient data with precision and accuracy.
  • Automotive Electronics: Embedded in automotive control units and infotainment systems to manage data streams and enhance vehicle performance.
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