72V261LA10TF8
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- Mfr.Part #
- 72V261LA10TF8
- Manufacturer
- Intersil (Renesas Electronics Corporation)
- Package / Case
- LQFP
- Datasheet
- Download
- Description
- IC FIFO SS 8192X18 10NS 64QFP
- Stock
- 2,762
- In Stock ：
- 2,762
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- Manufacturer :
- Intersil (Renesas Electronics Corporation)
- Product Category :
- FIFOs Memory
- Operating Supply Voltage :
- 3.3V
- Number of Terminations :
- 64
- Min Operating Temperature :
- 0°C
- Bus Directional :
- Unidirectional
- Thickness :
- 1.4mm
- Number of Pins :
- 64
- Frequency :
- 100MHz
- Max Operating Temperature :
- 70°C
- JESD-609 Code :
- e0
- Organization :
- 16KX9
- Supply Voltage :
- 3.3V
- Max Supply Current :
- 55mA
- Temperature Grade :
- COMMERCIAL
- Qualification Status :
- Not Qualified
- Package / Case :
- LQFP
- Number of Functions :
- 1
- Pbfree Code :
- No
- Terminal Finish :
- Tin/Lead (Sn85Pb15)
- Packaging :
- Tape and Reel
- Retransmit Capability :
- yes
- HTS Code :
- 8542.32.00.71
- Frequency (Max) :
- 100MHz
- Terminal Pitch :
- 0.5mm
- Cycle Time :
- 10 ns
- Height Seated (Max) :
- 1.6mm
- ECCN Code :
- EAR99
- Nominal Supply Current :
- 55mA
- Length :
- 10mm
- Max Supply Voltage :
- 3.6V
- Width :
- 10mm
- Terminal Position :
- QUAD
- Standby Current-Max :
- 0.015A
- Element Configuration :
- Dual
- Published :
- 2002
- Pin Count :
- 64
- Time@Peak Reflow Temperature-Max (s) :
- 20
- Peak Reflow Temperature (Cel) :
- 240
- Density :
- 144 kb
- Factory Lead Time :
- 7 Weeks
- Memory IC Type :
- OTHER FIFO
- Word Size :
- 9b
- Lead Free :
- Contains Lead
- Min Supply Voltage :
- 3V
- RoHS Status :
- RoHS Compliant
- Mount :
- Surface Mount
- Output Enable :
- yes
- Access Time :
- 6.5 ns
- Contact Plating :
- Lead, Tin
- Parallel/Serial :
- Parallel
- Terminal Form :
- Gull wing
- Sync/Async :
- SYNCHRONOUS
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Additional Feature :
- RETRANSMIT; AUTO POWER DOWN
- Datasheets
- 72V261LA10TF8
FIFOs Memory Intersil (Renesas Electronics Corporation) 72V261LA10TF8 Overview
Explore the cutting-edge capabilities of the FIFOs Memory Intersil (Renesas Electronics Corporation) 72V261LA10TF8. This integrated circuit offers unparalleled performance in managing data flow with its advanced features and robust design. Ideal for high-speed applications requiring efficient data buffering, this IC FIFO SS 8192X18 10NS 64QFP ensures smooth and seamless operation, making it a preferred choice for B2B clients seeking reliable solutions for their industrial needs.
72V261LA10TF8 Features
- High-speed operation: Delivers data transfer speeds with a latency of just 10 nanoseconds, ensuring swift processing.
- Large capacity: Offers a generous storage capacity of 8192 words by 18 bits, accommodating substantial amounts of data.
- Compact form factor: Housed in a 64QFP package, this IC saves space while maintaining high performance.
- Robust design: Built to withstand demanding industrial environments, ensuring reliability and longevity.
- Flexible compatibility: Compatible with a wide range of systems and devices, offering versatility in integration.
72V261LA10TF8 Applications
- Industrial Automation: The 72V261LA10TF8 is indispensable in industrial automation systems for managing data flow between sensors, controllers, and actuators with unparalleled speed and efficiency.
- Telecommunications: In telecommunications infrastructure, this IC plays a crucial role in buffering data streams, ensuring seamless transmission and reception of signals in high-speed networks.
- Medical Devices: Medical equipment manufacturers rely on the 72V261LA10TF8 to handle data processing tasks in devices such as patient monitors, diagnostic equipment, and imaging systems, ensuring accurate and real-time data acquisition.
- Networking Equipment: Within networking equipment such as routers, switches, and network interface cards, this IC optimizes data transfer, enabling smooth communication between devices in both wired and wireless networks.
- Automotive Electronics: Automotive systems leverage the 72V261LA10TF8 for managing data exchange between various onboard components, enhancing vehicle performance, safety, and connectivity.
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