72V261LA10TF8
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- Mfr.Part #
- 72V261LA10TF8
- Manufacturer
- Intersil (Renesas Electronics Corporation)
- Package / Case
- LQFP
- Datasheet
- Download
- Description
- IC FIFO SS 8192X18 10NS 64QFP
- Stock
- 2,762
- In Stock ：
- 2,762
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- Manufacturer :
- Intersil (Renesas Electronics Corporation)
- Product Category :
- FIFOs Memory
- Mount :
- Surface Mount
- Retransmit Capability :
- yes
- Terminal Finish :
- Tin/Lead (Sn85Pb15)
- Frequency (Max) :
- 100MHz
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Nominal Supply Current :
- 55mA
- ECCN Code :
- EAR99
- Peak Reflow Temperature (Cel) :
- 240
- Terminal Form :
- Gull wing
- Max Operating Temperature :
- 70°C
- RoHS Status :
- RoHS Compliant
- Density :
- 144 kb
- Qualification Status :
- Not Qualified
- Published :
- 2002
- Thickness :
- 1.4mm
- Organization :
- 16KX9
- Packaging :
- Tape and Reel
- Access Time :
- 6.5 ns
- Terminal Position :
- QUAD
- Max Supply Current :
- 55mA
- Supply Voltage :
- 3.3V
- Terminal Pitch :
- 0.5mm
- HTS Code :
- 8542.32.00.71
- Bus Directional :
- Unidirectional
- Standby Current-Max :
- 0.015A
- Frequency :
- 100MHz
- Factory Lead Time :
- 7 Weeks
- Sync/Async :
- SYNCHRONOUS
- Memory IC Type :
- OTHER FIFO
- Operating Supply Voltage :
- 3.3V
- JESD-609 Code :
- e0
- Temperature Grade :
- COMMERCIAL
- Additional Feature :
- RETRANSMIT; AUTO POWER DOWN
- Pbfree Code :
- No
- Time@Peak Reflow Temperature-Max (s) :
- 20
- Cycle Time :
- 10 ns
- Lead Free :
- Contains Lead
- Package / Case :
- LQFP
- Number of Terminations :
- 64
- Pin Count :
- 64
- Min Operating Temperature :
- 0°C
- Element Configuration :
- Dual
- Output Enable :
- yes
- Width :
- 10mm
- Number of Functions :
- 1
- Parallel/Serial :
- Parallel
- Contact Plating :
- Lead, Tin
- Word Size :
- 9b
- Max Supply Voltage :
- 3.6V
- Min Supply Voltage :
- 3V
- Length :
- 10mm
- Number of Pins :
- 64
- Height Seated (Max) :
- 1.6mm
- Datasheets
- 72V261LA10TF8
FIFOs Memory Intersil (Renesas Electronics Corporation) 72V261LA10TF8 Overview
Explore the cutting-edge capabilities of the FIFOs Memory Intersil (Renesas Electronics Corporation) 72V261LA10TF8. This integrated circuit offers unparalleled performance in managing data flow with its advanced features and robust design. Ideal for high-speed applications requiring efficient data buffering, this IC FIFO SS 8192X18 10NS 64QFP ensures smooth and seamless operation, making it a preferred choice for B2B clients seeking reliable solutions for their industrial needs.
72V261LA10TF8 Features
- High-speed operation: Delivers data transfer speeds with a latency of just 10 nanoseconds, ensuring swift processing.
- Large capacity: Offers a generous storage capacity of 8192 words by 18 bits, accommodating substantial amounts of data.
- Compact form factor: Housed in a 64QFP package, this IC saves space while maintaining high performance.
- Robust design: Built to withstand demanding industrial environments, ensuring reliability and longevity.
- Flexible compatibility: Compatible with a wide range of systems and devices, offering versatility in integration.
72V261LA10TF8 Applications
- Industrial Automation: The 72V261LA10TF8 is indispensable in industrial automation systems for managing data flow between sensors, controllers, and actuators with unparalleled speed and efficiency.
- Telecommunications: In telecommunications infrastructure, this IC plays a crucial role in buffering data streams, ensuring seamless transmission and reception of signals in high-speed networks.
- Medical Devices: Medical equipment manufacturers rely on the 72V261LA10TF8 to handle data processing tasks in devices such as patient monitors, diagnostic equipment, and imaging systems, ensuring accurate and real-time data acquisition.
- Networking Equipment: Within networking equipment such as routers, switches, and network interface cards, this IC optimizes data transfer, enabling smooth communication between devices in both wired and wireless networks.
- Automotive Electronics: Automotive systems leverage the 72V261LA10TF8 for managing data exchange between various onboard components, enhancing vehicle performance, safety, and connectivity.
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