72V261LA10PF8
- Mfr.Part #
- 72V261LA10PF8
- Manufacturer
- Intersil (Renesas Electronics Corporation)
- Package / Case
- LQFP
- Datasheet
- Download
- Description
- IC FIFO SS 8192X18 10NS 64QFP
- Stock
- 16,338
- In Stock :
- 16,338
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- Manufacturer :
- Intersil (Renesas Electronics Corporation)
- Product Category :
- FIFOs Memory
- Number of Functions :
- 1
- Memory Density :
- 147456 bit
- Package / Case :
- LQFP
- Terminal Finish :
- Tin/Lead (Sn85Pb15)
- Supply Voltage :
- 3.3V
- Operating Supply Voltage :
- 3.3V
- Organization :
- 16KX9
- Bus Directional :
- Unidirectional
- Lead Free :
- Contains Lead
- Time@Peak Reflow Temperature-Max (s) :
- 20
- Packaging :
- Tape and Reel
- Element Configuration :
- Dual
- Terminal Pitch :
- 0.8mm
- Max Operating Temperature :
- 70°C
- RoHS Status :
- RoHS Compliant
- Length :
- 14mm
- Standby Current-Max :
- 0.015A
- Frequency (Max) :
- 100MHz
- Pin Count :
- 64
- JESD-609 Code :
- e0
- Max Supply Current :
- 55mA
- Number of Terminations :
- 64
- Height Seated (Max) :
- 1.6mm
- Additional Feature :
- RETRANSMIT; AUTO POWER DOWN
- Pbfree Code :
- No
- Temperature Grade :
- COMMERCIAL
- Retransmit Capability :
- yes
- HTS Code :
- 8542.32.00.71
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Terminal Form :
- Gull wing
- Qualification Status :
- Not Qualified
- ECCN Code :
- EAR99
- Factory Lead Time :
- 7 Weeks
- Contact Plating :
- Lead, Tin
- Max Supply Voltage :
- 3.6V
- Operating Mode :
- SYNCHRONOUS
- Min Supply Voltage :
- 3V
- Cycle Time :
- 10 ns
- Parallel/Serial :
- Parallel
- Peak Reflow Temperature (Cel) :
- 240
- Output Enable :
- yes
- Min Operating Temperature :
- 0°C
- Width :
- 14mm
- Memory IC Type :
- OTHER FIFO
- Access Time :
- 6.5 ns
- Number of Pins :
- 64
- Thickness :
- 1.4mm
- Mount :
- Surface Mount
- Published :
- 2009
- Terminal Position :
- QUAD
- Datasheets
- 72V261LA10PF8

[FIFOs Memory Intersil (Renesas Electronics Corporation) 72V261LA10PF8] Overview
Introducing the cutting-edge IC FIFO SS 8192X18 10NS 64QFP by Intersil (Renesas Electronics Corporation), a pioneering solution revolutionizing data storage and retrieval in digital systems. Engineered with precision and reliability, this integrated circuit boasts unparalleled performance, making it an indispensable component for various industrial applications.
72V261LA10PF8 Features
- High-Speed Operation: With a blazing fast speed of 10 nanoseconds, this FIFO IC ensures rapid data access and transfer, optimizing system efficiency.
- Ample Storage Capacity: Equipped with an impressive 8192x18 configuration, it offers ample space for storing critical data, accommodating the demands of diverse applications.
- Compact Form Factor: Housed in a space-saving 64QFP package, this IC facilitates seamless integration into compact electronic devices, conserving valuable board space.
- Robust Design: Built to withstand rigorous operating conditions, this IC demonstrates exceptional durability and reliability, ensuring consistent performance in challenging environments.
- Low Power Consumption: Despite its high-speed operation, this FIFO IC maintains energy efficiency, minimizing power consumption and extending battery life in portable devices.
72V261LA10PF8 Applications
- Industrial Automation: This FIFO IC is instrumental in industrial automation systems, facilitating efficient data buffering and transfer in manufacturing processes, robotic control, and equipment monitoring.
- Telecommunications: In telecommunications infrastructure, the 72V261LA10PF8 serves as a vital component for data buffering and synchronization in network switches, routers, and base stations, ensuring seamless communication.
- Medical Devices: Within medical equipment such as patient monitors, diagnostic devices, and imaging systems, this FIFO IC enables swift and reliable data handling, supporting accurate diagnosis and treatment.
- Automotive Electronics: In automotive electronics, this IC plays a crucial role in data storage and retrieval for advanced driver assistance systems (ADAS), infotainment systems, and vehicle diagnostics, enhancing safety and connectivity.
- Embedded Systems: Embedded in a wide range of electronic devices, including consumer electronics, IoT devices, and aerospace systems, this FIFO IC enables efficient data management, enhancing overall system performance and functionality.
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