72V255LA20TF
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- Mfr.Part #
- 72V255LA20TF
- Manufacturer
- Intersil (Renesas Electronics Corporation)
- Package / Case
- LQFP
- Datasheet
- Download
- Description
- IC FIFO SS 8192X18 20NS 64-STQFP
- Stock
- 41,630
- In Stock ：
- 41,630
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- Manufacturer :
- Intersil (Renesas Electronics Corporation)
- Product Category :
- FIFOs Memory
- Number of Terminations :
- 64
- Temperature Grade :
- COMMERCIAL
- Organization :
- 8KX18
- Package / Case :
- LQFP
- Terminal Form :
- Gull wing
- Output Enable :
- yes
- JESD-609 Code :
- e0
- Radiation Hardening :
- No
- Min Supply Voltage :
- 3V
- Standby Current-Max :
- 0.015A
- RoHS Status :
- RoHS Compliant
- Time@Peak Reflow Temperature-Max (s) :
- 20
- Sync/Async :
- SYNCHRONOUS
- Thickness :
- 1.4mm
- Max Supply Voltage :
- 3.6V
- Operating Supply Voltage :
- 3.3V
- Number of Functions :
- 1
- Supply Voltage :
- 3.3V
- Terminal Pitch :
- 0.5mm
- HTS Code :
- 8542.32.00.71
- Factory Lead Time :
- 7 Weeks
- Memory IC Type :
- OTHER FIFO
- Min Operating Temperature :
- 0°C
- Cycle Time :
- 20 ns
- Max Supply Current :
- 55mA
- Word Size :
- 18b
- Density :
- 144 kb
- Frequency (Max) :
- 50MHz
- Terminal Finish :
- Tin/Lead (Sn85Pb15)
- Max Operating Temperature :
- 70°C
- Data Bus Width :
- 18b
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Additional Feature :
- RETRANSMIT
- Mount :
- Surface Mount
- Bus Directional :
- Unidirectional
- Width :
- 10mm
- Access Time :
- 12 ns
- Nominal Supply Current :
- 55mA
- Lead Free :
- Contains Lead
- Terminal Position :
- QUAD
- Number of Pins :
- 64
- Length :
- 10mm
- Retransmit Capability :
- yes
- Peak Reflow Temperature (Cel) :
- 240
- Element Configuration :
- Dual
- Pin Count :
- 64
- Contact Plating :
- Lead, Tin
- Pbfree Code :
- No
- Parallel/Serial :
- Parallel
- ECCN Code :
- EAR99
- Published :
- 2008
- Height Seated (Max) :
- 1.6mm
- Frequency :
- 50MHz
- Datasheets
- 72V255LA20TF
FIFOs Memory Intersil (Renesas Electronics Corporation) 72V255LA20TF Overview
Introducing the 72V255LA20TF from Intersil (Renesas Electronics Corporation), a high-performance FIFO (First-In, First-Out) memory IC, optimized for advanced data buffering applications. This FIFO memory component is designed to handle a substantial depth of 8192x18 bits, with a swift access time of 20 ns, encapsulated in a 64STQFP package. The 72V255LA20TF is engineered to support high-speed data communication and processing requirements, making it an essential element in sophisticated electronic systems where data integrity and speed are crucial. Its robust design ensures reliability and performance, making it a preferred choice for manufacturers aiming to enhance system efficiency and throughput.
72V255LA20TF Features
The 72V255LA20TF boasts several key features that make it highly advantageous for use in various high-speed computing and data processing environments. Key features include a large storage capacity of 8192x18 bits, ensuring ample space for data queuing and retrieval. The device's 20 ns access time facilitates rapid data handling, crucial for performance-critical applications. Moreover, its 64STQFP packaging is designed for compact yet robust integration into a variety of electronic assemblies.
72V255LA20TF Applications
- Telecommunications: In telecommunication systems, the 72V255LA20TF serves as a critical buffer component, managing data flow between processors and transmission mediums to prevent data loss during high-speed data transfer.
- Networking Equipment: Utilized in routers and switches, this FIFO memory helps in managing burst data from multiple sources, ensuring smooth and efficient network traffic handling.
- Video Processing: In video processing units, the 72V255LA20TF is essential for buffering video data streams, thus maintaining the integrity of video feeds and reducing latency.
- Industrial Control Systems: For industrial applications, it provides reliable data queuing for sensor readings and control signals, ensuring timely and sequential processing.
- Medical Equipment: This FIFO memory is used in medical imaging devices, where it buffers large volumes of imaging data, helping in the rapid processing and analysis required for medical diagnostics.
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