72V2113L10PF
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- Mfr.Part #
- 72V2113L10PF
- Manufacturer
- Intersil (Renesas Electronics Corporation)
- Package / Case
- TQFP
- Datasheet
- Download
- Description
- IC FIFO SUPERSYNCII 10NS 80-TQFP
- Stock
- 30,129
- In Stock ：
- 30,129
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- Manufacturer :
- Intersil (Renesas Electronics Corporation)
- Product Category :
- FIFOs Memory
- Max Operating Temperature :
- 70°C
- Operating Supply Voltage :
- 3.3V
- Peak Reflow Temperature (Cel) :
- 240
- Number of Terminations :
- 80
- Min Supply Voltage :
- 3.15V
- ECCN Code :
- EAR99
- Lead Free :
- Contains Lead
- Retransmit Capability :
- yes
- Mount :
- Surface Mount
- Cycle Time :
- 10 ns
- Pbfree Code :
- No
- Terminal Pitch :
- 0.65mm
- Standby Current-Max :
- 0.015A
- Terminal Form :
- Gull wing
- Contact Plating :
- Lead, Tin
- Height Seated (Max) :
- 1.6mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- RoHS Status :
- RoHS Compliant
- Number of Pins :
- 80
- Element Configuration :
- Dual
- Min Operating Temperature :
- 0°C
- Pin Count :
- 80
- Terminal Position :
- QUAD
- Nominal Supply Current :
- 35mA
- Published :
- 2009
- Factory Lead Time :
- 7 Weeks
- Width :
- 14mm
- Qualification Status :
- Not Qualified
- Sync/Async :
- SYNCHRONOUS
- JESD-609 Code :
- e0
- Access Time :
- 6.5 ns
- Supply Voltage :
- 3.3V
- Thickness :
- 1.4mm
- Max Supply Current :
- 35mA
- Number of Functions :
- 1
- Density :
- 4.5 Mb
- Bus Directional :
- Unidirectional
- Package / Case :
- TQFP
- Parallel/Serial :
- Parallel
- Frequency :
- 100MHz
- Organization :
- 256KX18
- Length :
- 14mm
- Max Supply Voltage :
- 3.45V
- Time@Peak Reflow Temperature-Max (s) :
- 20
- Output Enable :
- yes
- Memory IC Type :
- OTHER FIFO
- HTS Code :
- 8542.32.00.71
- Temperature Grade :
- COMMERCIAL
- Terminal Finish :
- Tin/Lead (Sn85Pb15)
- Frequency (Max) :
- 100MHz
- Datasheets
- 72V2113L10PF
FIFOs Memory Intersil (Renesas Electronics Corporation) 72V2113L10PF Overview
The 72V2113L10PF by Intersil (Renesas Electronics Corporation), a renowned leader in the development of Integrated Circuits, represents a high-performance solution in the field of FIFO (First In, First Out) memory components. Designed to enhance data buffering in high-speed systems, this SuperSync II FIFO offers exceptional performance with a minimal operational speed of 10ns, packaged efficiently in an 80TQFP format. Its robust design and reliable data handling capabilities make it an essential component for developers aiming to optimize data flow in advanced communication and processing systems, ensuring minimal latency and high throughput in critical applications. The integration of such FIFOs Memory Intersil (Renesas Electronics Corporation) 72V2113L10PF components in your systems guarantees enhanced performance and reliability, vital for handling complex data streams in high-demand environments.
72V2113L10PF Features
This FIFO memory IC boasts a suite of features that elevate its utility in sophisticated electronic systems. Key features include its rapid 10 ns operational speed and the compact 80TQFP packaging, which allows for efficient use of board space while maintaining performance integrity. Additionally, its ability to handle multiple data widths and depth configurations provides flexibility across various applications, further enhanced by its low power consumption and high data reliability.
72V2113L10PF Applications
- Telecommunications Equipment: Utilized for data buffering in routers and switches, enhancing performance by maintaining steady data flow and preventing packet loss.
- Video Broadcasting: Critical in managing data streams in real-time video processing units, ensuring seamless transmission and synchronization of video signals.
- High-Speed Data Acquisition Systems: Employs in capturing data at high speeds in scientific and industrial environments, providing reliable and consistent data flow necessary for accurate analysis.
- Server and Storage Applications: Improves data transfer rates between high-speed servers and storage devices, optimizing overall system efficiency and response times.
- Networking and Data Communication: Enhances bandwidth and reduces latency in network infrastructure, crucial for supporting high-speed internet and network services.
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