72T3685L5BBI

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Mfr.Part #
72T3685L5BBI
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
BGA
Datasheet
Download
Description
IC FIFO 16384X36 5NS 208-BGA
Stock
6,298
In Stock :
6,298

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
FIFOs Memory
Base Part Number :
72T3685
Element Configuration :
Dual
Thickness :
1.76mm
Height Seated (Max) :
1.97mm
Sync/Async :
ASYNCHRONOUS
Density :
576 kb
Max Operating Temperature :
85°C
Mounting Type :
Surface Mount
Temperature Grade :
Industrial
Terminal Finish :
Tin/Lead (Sn63Pb37)
Operating Temperature :
-40°C ~ 85°C
Number of Terminations :
208
Cycle Time :
5 ns
Packaging :
Tray
Current - Supply (Max) :
70mA
Pin Count :
208
Operating Supply Voltage :
2.5V
FWFT Support :
yes
Peak Reflow Temperature (Cel) :
225
Function :
Asynchronous, Synchronous
RoHS Status :
RoHS Compliant
Number of Functions :
1
JESD-609 Code :
e0
Frequency (Max) :
200MHz
Access Time :
3.6 ns
Parallel/Serial :
Parallel
Supplier Device Package :
208-PBGA (17x17)
Series :
72T
Memory Size :
576K (16K x 36)
HTS Code :
8542.32.00.71
Min Supply Voltage :
2.375V
Programmable Flags Support :
yes
Word Size :
36b
Min Operating Temperature :
-40°C
Number of Pins :
208
Output Enable :
yes
Width :
17mm
Terminal Form :
Ball
Bus Directional :
Unidirectional
Memory IC Type :
OTHER FIFO
Organization :
16KX36
Terminal Pitch :
1mm
Lead Free :
Contains Lead
Mount :
Surface Mount
ECCN Code :
EAR99
Supply Voltage :
2.5V
Nominal Supply Current :
70mA
Max Supply Current :
70mA
Package / Case :
BGA
Max Supply Voltage :
2.625V
Voltage - Supply :
2.375V ~ 2.625V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Pbfree Code :
No
Retransmit Capability :
yes
Expansion Type :
Depth, Width
Length :
17mm
Contact Plating :
Lead, Tin
Qualification Status :
Not Qualified
Standby Current-Max :
0.01A
Terminal Position :
BOTTOM
Published :
2009
Data Rate :
83MHz, 200MHz
Time@Peak Reflow Temperature-Max (s) :
20
Datasheets
72T3685L5BBI
Introducing FIFOs Memory Intersil (Renesas Electronics Corporation) 72T3685L5BBI from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:72T3685, Mounting Type:Surface Mount, Operating Temperature:-40°C ~ 85°C, Number of Terminations:208, Number of Pins:208, Package / Case:BGA, 72T3685L5BBI pinout, 72T3685L5BBI datasheet PDF, 72T3685L5BBI amp .Beyond FIFOs Memory Intersil (Renesas Electronics Corporation) 72T3685L5BBI ,we also offer CY7C433-40JC, SN74ACT7201LA35RJ, SN74ACT7201LA35NP, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 72T3685L5BBI


FIFOs Memory Intersil (Renesas Electronics Corporation) 72T3685L5BBI Overview

The FIFOs Memory Intersil (Renesas Electronics Corporation) 72T3685L5BBI is a high-performance integrated circuit designed for demanding applications requiring robust data buffering and storage. This IC provides a large 16384x36 storage matrix, operating at an ultra-fast 5 ns speed, housed in a compact 208 BGA package. It offers reliable performance in data throughput and is engineered to support advanced data management and signal integrity. Ideal for systems requiring high-speed data acquisition and real-time processing, the 72T3685L5BBI stands out as a critical component for enhancing system reliability and efficiency in complex digital environments.

72T3685L5BBI Features

The 72T3685L5BBI FIFO memory boasts several key features that make it an exceptional choice for high-speed data applications:

  • Large data capacity of 16384x36, allowing extensive data storage and retrieval.
  • High-speed performance with a minimal access time of 5 nanoseconds.
  • Compact 208-Ball Grid Array (BGA) package, ensuring a minimal footprint on system boards.
  • Designed for easy integration into various digital systems with its standardized interface.

72T3685L5BBI Applications

  • Telecommunications Infrastructure: Utilized in network routers and switches to manage data packets efficiently, ensuring seamless data flow and reduced latency in communication systems.
  • Video Broadcasting: Essential in video processing equipment for buffering video streams, enhancing the quality and reliability of broadcast signals.
  • High-Speed Computing: Deployed in servers and high-performance computers for fast data caching, improving system responsiveness and processing capabilities.
  • Industrial Control Systems: Helps in managing real-time data in industrial environments, ensuring timely and accurate control and automation of processes.
  • Medical Imaging Systems: Critical in handling large volumes of imaging data swiftly, aiding in faster diagnostics and better patient care outcomes.
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