70V659S12DR

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Mfr.Part #
70V659S12DR
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
PQFP
Datasheet
Download
Description
IC SRAM 4.5MBIT PARALLEL 208PQFP
Stock
31,548
In Stock :
31,548

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Pin Count :
208
Length :
28mm
Mounting Type :
Surface Mount
Width :
28mm
Memory Interface :
Parallel
Temperature Grade :
COMMERCIAL
Word Size :
36b
Output Characteristics :
3-STATE
Number of Pins :
208
Number of Ports :
2
Time@Peak Reflow Temperature-Max (s) :
20
Max Supply Voltage :
3.45V
Terminal Finish :
Tin/Lead (Sn/Pb)
Access Time :
12 ns
Number of Functions :
1
Memory Type :
RAM, SDR, SRAM
Packaging :
Tray
Operating Temperature :
0°C ~ 70°C (TA)
Max Supply Current :
465mA
Terminal Form :
Gull wing
Interface :
Parallel
Factory Lead Time :
7 Weeks
Terminal Pitch :
0.5mm
Package / Case :
PQFP
Radiation Hardening :
No
Memory Size :
512kB
RoHS Status :
RoHS Compliant
Height Seated (Max) :
4.1mm
Thickness :
3.5mm
Published :
2009
Max Operating Temperature :
70°C
Standby Current-Max :
0.015A
Peak Reflow Temperature (Cel) :
225
Density :
4.5 Mb
Address Bus Width :
34b
Operating Supply Voltage :
3.3V
Lead Free :
Contains Lead
Memory Format :
SRAM
Mount :
Surface Mount
I/O Type :
COMMON
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Sync/Async :
ASYNCHRONOUS
Write Cycle Time - Word, Page :
12ns
Min Operating Temperature :
0°C
Supply Voltage :
3.3V
Min Supply Voltage :
3.15V
Supplier Device Package :
208-PQFP (28x28)
Terminal Position :
QUAD
JESD-609 Code :
e0
Nominal Supply Current :
465mA
Voltage - Supply :
3.15 V ~ 3.45 V
Number of Terminations :
208
Pbfree Code :
No
Series :
--
Base Part Number :
IDT70V659
Datasheets
70V659S12DR
Introducing Memory Intersil (Renesas Electronics Corporation) 70V659S12DR from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Pins:208, Operating Temperature:0°C ~ 70°C (TA), Package / Case:PQFP, Number of Terminations:208, Base Part Number:IDT70V659, 70V659S12DR pinout, 70V659S12DR datasheet PDF, 70V659S12DR amp .Beyond Memory Intersil (Renesas Electronics Corporation) 70V659S12DR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 70V659S12DR


Memory Intersil (Renesas Electronics Corporation) 70V659S12DR Overview

Unlock the potential of high-speed and high-capacity data storage with the Memory Intersil (Renesas Electronics Corporation) 70V659S12DR SRAM chip. This robust IC features a significant 4.5Mbit storage capacity and is packed into a compact 208PQFP package, offering a solution optimized for performance and reliability in complex applications. The integration of this advanced technology supports critical real-time processing and storage demands, making it an ideal component for manufacturers looking to enhance their products with reliable memory management capabilities. Its parallel interface ensures quick data access and seamless integration into existing architectures, highlighting its versatility and superior design.

70V659S12DR Features

The 70V659S12DR SRAM chip by Intersil (Renesas Electronics Corporation) delivers exceptional features that include 4.5MBIT of parallel SRAM, housed in a practical 208PQFP package. This component ensures rapid access speeds and is designed for low-power operation, facilitating extended operational efficiency and stability. Its parallel interface not only accelerates the throughput but also simplifies the system design, allowing for easier integration into various industrial applications.

70V659S12DR Applications

  • Advanced Networking Equipment: Utilized in routers and switches to manage routing tables more efficiently, enhancing network performance and reliability.
  • High-performance Computing: Employs in servers and supercomputers for fast data buffering and cache solutions, supporting intensive computational tasks and data analysis.
  • Automotive Electronics: Integrated into automotive systems for managing real-time vehicle telemetry and infotainment systems, improving responsiveness and user experience.
  • Industrial Automation: Applied in PLCs and industrial PCs to handle complex processes and control tasks, increasing the reliability and efficiency of automated systems.
  • Telecommunications: Used in telecommunications infrastructure to enhance data processing capabilities, supporting high-speed data transmission and signal processing.
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