70V3319S166PRF8

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Mfr.Part #
70V3319S166PRF8
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
TQFP
Datasheet
Download
Description
IC SRAM 4.5MBIT PARALLEL 128TQFP
Stock
25,815
In Stock :
25,815

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Min Supply Voltage :
3.15V
Peak Reflow Temperature (Cel) :
225
Output Characteristics :
3-STATE
Pbfree Code :
No
Width :
14mm
Max Supply Voltage :
3.45V
Interface :
Parallel
Terminal Finish :
Tin/Lead (Sn85Pb15)
Additional Feature :
PIPELINED OR FLOW-THROUGH ARCHITECTURE
Min Operating Temperature :
0°C
Thickness :
1.4mm
Frequency :
166MHz
Number of Terminations :
128
Standby Current-Max :
0.03A
Terminal Position :
QUAD
Nominal Supply Current :
500mA
Max Operating Temperature :
70°C
Pin Count :
128
Temperature Grade :
COMMERCIAL
Access Time :
12 ns
JESD-609 Code :
e0
Number of Ports :
2
Voltage - Supply :
3.15 V ~ 3.45 V
Published :
2009
Supply Voltage :
3.3V
Packaging :
Tape and Reel
RoHS Status :
RoHS Compliant
Terminal Pitch :
0.5mm
Address Bus Width :
36b
Mounting Type :
Surface Mount
Operating Temperature :
0°C ~ 70°C (TA)
Operating Supply Voltage :
3.3V
Write Cycle Time - Word, Page :
--
Memory Type :
RAM, SRAM
Number of Pins :
128
Supplier Device Package :
128-TQFP (14x20)
Number of Functions :
1
Package / Case :
TQFP
Memory Size :
4.5Mb (256K x 18)
Terminal Form :
Gull wing
I/O Type :
COMMON
Memory Format :
SRAM
Length :
20mm
Height Seated (Max) :
1.6mm
Factory Lead Time :
7 Weeks
Lead Free :
Contains Lead
Clock Frequency :
166MHz
Radiation Hardening :
No
Word Size :
18b
Density :
4.5 Mb
Mount :
Surface Mount
Series :
--
Sync/Async :
SYNCHRONOUS
Memory Interface :
Parallel
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Base Part Number :
IDT70V3319
Datasheets
70V3319S166PRF8
Introducing Memory Intersil (Renesas Electronics Corporation) 70V3319S166PRF8 from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:128, Mounting Type:Surface Mount, Operating Temperature:0°C ~ 70°C (TA), Number of Pins:128, Package / Case:TQFP, Base Part Number:IDT70V3319, 70V3319S166PRF8 pinout, 70V3319S166PRF8 datasheet PDF, 70V3319S166PRF8 amp .Beyond Memory Intersil (Renesas Electronics Corporation) 70V3319S166PRF8 ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 70V3319S166PRF8


Memory Intersil (Renesas Electronics Corporation) 70V3319S166PRF8 Overview

The Memory Intersil (Renesas Electronics Corporation) 70V3319S166PRF8 IC SRAM represents a high-performance solution designed for demanding data storage and retrieval operations in advanced electronic systems. This integrated circuit boasts a substantial 4.5 Mbit storage capacity, housed within a 128TQFP package that ensures compactness and ease of integration into a variety of industrial designs. Engineered for parallel interface applications, this SRAM module provides robust, high-speed data access, making it an indispensable component in applications requiring rapid data buffering and significant temporary data storage.

70V3319S166PRF8 Features

  • 4.5 Mbit high-speed SRAM: Large storage capacity suitable for extensive data buffering.
  • Parallel interface: Ensures fast data access and straightforward integration with mainstream microprocessors and digital systems.
  • 128TQFP packaging: Compact and reliable packaging designed for optimal integration in space-constrained applications.

70V3319S166PRF8 Applications

  • Networking Equipment: Utilized in routers and switches for packet buffering, ensuring efficient data flow and network stability.
  • Telecommunications: Critical for data buffering in telecom infrastructure, supporting high-speed data transmission and signal processing.
  • Industrial Automation: Employed in control systems for temporary data storage, facilitating rapid processing and real-time system responses.
  • Medical Devices: Used in medical imaging systems for fast data capture and temporary storage, crucial for high-resolution imaging processes.
  • Aerospace and Defense: Integral to avionics and military systems for data logging and mission-critical operations requiring fast and reliable data access.
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