70V261S35PF8

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Mfr.Part #
70V261S35PF8
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
TQFP
Datasheet
Download
Description
IC SRAM 256KBIT PARALLEL 100TQFP
Stock
49,539
In Stock :
49,539

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Thickness :
1.4mm
Min Supply Voltage :
3V
Number of Ports :
2
Number of Functions :
1
Time@Peak Reflow Temperature-Max (s) :
20
Radiation Hardening :
No
Memory Type :
RAM, SDR, SRAM
Supplier Device Package :
100-TQFP (14x14)
Memory Size :
32kB
Operating Supply Voltage :
3.3V
Organization :
16KX16
Terminal Pitch :
0.5mm
Published :
2001
Base Part Number :
IDT70V261
Voltage - Supply :
3 V ~ 3.6 V
Additional Feature :
INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
Packaging :
Tape and Reel (TR)
Pin Count :
100
Interface :
Parallel
Terminal Position :
QUAD
Lead Free :
Contains Lead
Pbfree Code :
No
Terminal Finish :
Tin/Lead (Sn85Pb15)
Factory Lead Time :
7 Weeks
JESD-609 Code :
e0
Address Bus Width :
28b
Supply Current-Max :
0.14mA
Series :
--
Number of Pins :
100
Length :
14mm
Terminal Form :
Gull wing
Supply Voltage :
3.3V
Max Operating Temperature :
70°C
Density :
256 kb
Peak Reflow Temperature (Cel) :
240
Access Time :
35 ns
Write Cycle Time - Word, Page :
35ns
Surface Mount :
yes
Standby Current-Max :
0.006A
Operating Temperature :
0°C ~ 70°C (TA)
I/O Type :
COMMON
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Height Seated (Max) :
1.6mm
Temperature Grade :
COMMERCIAL
Min Operating Temperature :
0°C
ECCN Code :
EAR99
Number of Terminations :
100
RoHS Status :
RoHS Compliant
Mounting Type :
Surface Mount
Memory Interface :
Parallel
Package / Case :
TQFP
Width :
14mm
Standby Voltage-Min :
3V
Memory Format :
SRAM
Max Supply Voltage :
3.6V
Output Characteristics :
3-STATE
Datasheets
70V261S35PF8
Introducing Memory Intersil (Renesas Electronics Corporation) 70V261S35PF8 from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:IDT70V261, Number of Pins:100, Operating Temperature:0°C ~ 70°C (TA), Number of Terminations:100, Mounting Type:Surface Mount, Package / Case:TQFP, 70V261S35PF8 pinout, 70V261S35PF8 datasheet PDF, 70V261S35PF8 amp .Beyond Memory Intersil (Renesas Electronics Corporation) 70V261S35PF8 ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 70V261S35PF8


Memory Intersil (Renesas Electronics Corporation) 70V261S35PF8 Overview

The Memory Intersil (Renesas Electronics Corporation) 70V261S35PF8 IC is a high-performance, 256 Kbit SRAM chip encapsulated in a compact 100TQFP package. Designed for high-speed, reliable operation, this memory module offers an optimal solution for demanding applications that require quick access to large volumes of data. With its parallel interface, it provides enhanced data integrity and speed, making it an excellent choice for integrating into advanced digital systems. This product stands out in the marketplace for its robust feature set tailored to meet the technical demands of contemporary integrated circuits.

70V261S35PF8 Features

This SRAM unit features a parallel interface, allowing for rapid data access and high throughput, essential for performance-critical applications. The 100TQFP packaging not only ensures a minimal footprint on system boards but also offers excellent reliability and durability under varied environmental conditions. Furthermore, the chip's low power consumption makes it suitable for energy-efficient designs, helping developers maintain a balance between performance and power efficiency.

70V261S35PF8 Applications

  • Networking Equipment: Utilized in routers and switches, the 70V261S35PF8 helps manage data flow efficiently, ensuring high-speed data processing and enhanced network reliability.
  • Industrial Automation: In PLCs and other control systems, this SRAM provides the necessary speed and capacity to handle complex automation tasks quickly and reliably.
  • Telecommunications: Essential for telecommunications infrastructure, such as signal processing equipment, where fast access to buffer memory is crucial for maintaining high throughput and system stability.
  • Consumer Electronics: Applied in devices such as high-definition televisions and gaming consoles, where quick memory access speeds are necessary to handle dynamic visual data and user inputs seamlessly.
  • Automotive Systems: Supports advanced automotive applications, including infotainment systems and driver assist technologies, offering robust data handling capabilities to enhance vehicle performance and safety.
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