70V25L20J
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- Mfr.Part #
- 70V25L20J
- Manufacturer
- Intersil (Renesas Electronics Corporation)
- Package / Case
- PLCC
- Datasheet
- Download
- Description
- IC SRAM 128KBIT PARALLEL 84PLCC
- Stock
- 3,633
- In Stock ：
- 3,633
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- Manufacturer :
- Intersil (Renesas Electronics Corporation)
- Product Category :
- Memory
- Number of Ports :
- 2
- Standby Voltage-Min :
- 3V
- Series :
- --
- Package / Case :
- PLCC
- Max Operating Temperature :
- 70°C
- RoHS Status :
- RoHS Compliant
- Temperature Grade :
- COMMERCIAL
- Peak Reflow Temperature (Cel) :
- 225
- Lead Free :
- Contains Lead
- Length :
- 29.21mm
- Factory Lead Time :
- 7 Weeks
- Base Part Number :
- IDT70V25
- Number of Pins :
- 84
- Mount :
- Surface Mount
- Terminal Form :
- J BEND
- Memory Size :
- 128Kb (8K x 16)
- Voltage - Supply :
- 3 V ~ 3.6 V
- Supply Voltage :
- 3.3V
- Published :
- 2004
- Access Time :
- 20 ns
- Memory Interface :
- Parallel
- Operating Supply Voltage :
- 3.3V
- Pbfree Code :
- No
- Supplier Device Package :
- 84-PLCC (29.21x29.21)
- Min Supply Voltage :
- 3V
- Word Size :
- 16b
- Output Characteristics :
- 3-STATE
- I/O Type :
- COMMON
- Operating Temperature :
- 0°C ~ 70°C (TA)
- Number of Functions :
- 1
- Max Supply Voltage :
- 3.6V
- Write Cycle Time - Word, Page :
- 20ns
- Density :
- 128 kb
- Mounting Type :
- Surface Mount
- Sync/Async :
- ASYNCHRONOUS
- Radiation Hardening :
- No
- Width :
- 29.21mm
- Memory Format :
- SRAM
- Number of Terminations :
- 84
- Memory Type :
- RAM, SRAM
- JESD-609 Code :
- e0
- Terminal Finish :
- Tin/Lead (Sn85Pb15)
- Address Bus Width :
- 26b
- Thickness :
- 3.63mm
- Nominal Supply Current :
- 175mA
- Interface :
- Parallel
- Packaging :
- Tube
- Pin Count :
- 84
- Min Operating Temperature :
- 0°C
- Terminal Position :
- QUAD
- ECCN Code :
- EAR99
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Organization :
- 8KX16
- Datasheets
- 70V25L20J
Memory Intersil (Renesas Electronics Corporation) 70V25L20J Overview
The Intersil (Renesas Electronics Corporation) 70V25L20J SRAM offers robust high-performance data storage solutions, integrating 128KBIT of memory into a compact 84PLCC package. This component is engineered to meet the demands of high-speed computing and advanced data-intensive applications, making it a prime choice for businesses looking to enhance their technological infrastructure. The use of parallel interface technology ensures fast data access and throughput, essential for applications requiring quick response times and efficient operation. With its precise engineering and proven reliability, the Memory Intersil (Renesas Electronics Corporation) 70V25L20J is designed to support the complex and varying needs of modern electronic systems.
70V25L20J Features
The 70V25L20J SRAM by Intersil features a parallel interface for rapid data transmission, housed in a durable 84PLCC package that offers protection and longevity in a variety of operating environments. Key features include a large 128KBIT storage capacity, which is ideal for applications where speed and data integrity are critical. This SRAM is designed to operate with a high level of reliability, maintaining stability across a broad range of temperatures and conditions.
70V25L20J Applications
- Advanced Computing Systems: The high-speed parallel interface of the 70V25L20J makes it ideal for use in complex computational devices where quick memory access is crucial.
- Industrial Automation: Reliable and robust, this SRAM can handle the demanding conditions of automated manufacturing processes, improving system responsiveness and efficiency.
- Telecommunications Equipment: Essential for the smooth operation of telecommunications infrastructure, where rapid data buffering and integrity are necessary for high-speed data transfer.
- Aerospace and Defense: Offers the durability and precision required for aerospace applications, ensuring performance in critical navigation and communication systems.
- Medical Devices: Suitable for use in medical technology, particularly in equipment requiring high reliability for data storage in diagnostic and treatment applications.
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