70V08S25PF8

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Mfr.Part #
70V08S25PF8
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
TQFP
Datasheet
Download
Description
IC SRAM 512KBIT PARALLEL 100TQFP
Stock
40,765
In Stock :
40,765

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Min Supply Voltage :
3V
Radiation Hardening :
No
Max Supply Voltage :
3.6V
Peak Reflow Temperature (Cel) :
240
ECCN Code :
EAR99
Thickness :
1.4mm
Number of Ports :
2
Length :
14mm
Width :
14mm
Pin Count :
100
Interface :
Parallel
Sync/Async :
ASYNCHRONOUS
Density :
512 kb
Standby Current-Max :
0.006A
Lead Free :
Contains Lead
Operating Supply Voltage :
3.3V
Factory Lead Time :
7 Weeks
Temperature Grade :
COMMERCIAL
Mount :
Surface Mount
Min Operating Temperature :
0°C
Terminal Pitch :
0.5mm
Terminal Position :
QUAD
Height Seated (Max) :
1.6mm
I/O Type :
COMMON
RoHS Status :
RoHS Compliant
Number of Functions :
1
Organization :
64KX8
Supply Voltage :
3.3V
Max Operating Temperature :
70°C
Published :
2009
JESD-609 Code :
e0
Output Characteristics :
3-STATE
Standby Voltage-Min :
3V
Additional Feature :
SEMAPHORE
Terminal Finish :
Tin/Lead (Sn85Pb15)
Memory Type :
RAM, SDR, SRAM
Word Size :
8B
Time@Peak Reflow Temperature-Max (s) :
20
Package / Case :
TQFP
Terminal Form :
Gull wing
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Access Time :
25 ns
Number of Terminations :
100
Memory Size :
64KB
Nominal Supply Current :
205mA
Pbfree Code :
No
Address Bus Width :
32b
Number of Pins :
100
Datasheets
70V08S25PF8
Introducing Memory Intersil (Renesas Electronics Corporation) 70V08S25PF8 from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:TQFP, Number of Terminations:100, Number of Pins:100, 70V08S25PF8 pinout, 70V08S25PF8 datasheet PDF, 70V08S25PF8 amp .Beyond Memory Intersil (Renesas Electronics Corporation) 70V08S25PF8 ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 70V08S25PF8


Memory Intersil (Renesas Electronics Corporation) 70V08S25PF8 Overview

The Memory Intersil (Renesas Electronics Corporation) 70V08S25PF8 is a high-performance SRAM chip, designed for demanding applications that require quick access and high reliability. With a storage capacity of 512 Kbit and packaged in a compact 100TQFP, this integrated circuit ensures a blend of efficiency and durability. Tailored for systems where speed and space are at a premium, this SRAM is ideal for embedded systems requiring quick data retrieval without sacrificing footprint. Its parallel interface facilitates simpler integration with a wide range of microcontrollers and digital processors, making it a versatile choice for developers and engineers looking to maximize system performance and reliability.

70V08S25PF8 Features

The 70V08S25PF8 SRAM by Intersil boasts several notable features including its 512 Kbit capacity and the use of a parallel interface, which allows for fast data access and high throughput. The chip is encapsulated in a 100TQFP package, ensuring robustness and ease of mounting on a variety of board configurations. This memory component is designed for optimal reliability in rigorous environments, making it suitable for both commercial and industrial applications.

70V08S25PF8 Applications

  • Advanced Telecommunications: Deployed in telecommunications equipment to manage fast access to routing and signal processing data, enhancing performance and efficiency.
  • Automotive Electronics: Used in automotive systems to provide reliable, quick access memory for advanced driver-assistance systems (ADAS) and other in-vehicle networks, improving response times and safety features.
  • Industrial Automation: Integral in automation controllers, helping to handle complex processes by facilitating fast and reliable data exchanges necessary for real-time system management.
  • Consumer Electronics: Applied in devices such as digital cameras and gaming consoles, where quick data buffering is essential to user experience and device functionality.
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