70V07S25PF

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Mfr.Part #
70V07S25PF
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
TQFP
Datasheet
Download
Description
IC SRAM 256KBIT PARALLEL 80TQFP
Stock
18,039
In Stock :
18,039

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Address Bus Width :
30b
Operating Temperature :
0°C ~ 70°C (TA)
Density :
256 kb
Thickness :
1.4mm
Access Time :
25 ns
Min Operating Temperature :
0°C
Output Characteristics :
3-STATE
Length :
14mm
Factory Lead Time :
7 Weeks
I/O Type :
COMMON
Number of Functions :
1
Lead Free :
Contains Lead
Qualification Status :
Not Qualified
Peak Reflow Temperature (Cel) :
240
Time@Peak Reflow Temperature-Max (s) :
20
Supply Voltage :
3.3V
Number of Pins :
80
Write Cycle Time - Word, Page :
25ns
Additional Feature :
INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
Pin Count :
80
JESD-609 Code :
e0
Mounting Type :
Surface Mount
Memory Format :
SRAM
Temperature Grade :
COMMERCIAL
Voltage - Supply :
3 V ~ 3.6 V
Nominal Supply Current :
170mA
Mount :
Surface Mount
Base Part Number :
IDT70V07
Terminal Form :
Gull wing
Series :
--
ECCN Code :
EAR99
Operating Supply Voltage :
3.3V
Min Supply Voltage :
3V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Interface :
Parallel
Terminal Pitch :
0.65mm
Terminal Position :
QUAD
Published :
2005
Terminal Finish :
Tin/Lead (Sn85Pb15)
Packaging :
Tray
Height Seated (Max) :
1.6mm
Number of Ports :
2
Word Size :
8B
Package / Case :
TQFP
Pbfree Code :
No
Interface :
Parallel
Standby Voltage-Min :
3V
Width :
14mm
Max Operating Temperature :
70°C
Sync/Async :
ASYNCHRONOUS
Supplier Device Package :
80-TQFP (14x14)
Memory Type :
RAM, SDR, SRAM
Max Supply Voltage :
3.6V
RoHS Status :
RoHS Compliant
Memory Size :
32kB
Standby Current-Max :
0.006A
Number of Terminations :
80
Datasheets
70V07S25PF
Introducing Memory Intersil (Renesas Electronics Corporation) 70V07S25PF from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C ~ 70°C (TA), Number of Pins:80, Mounting Type:Surface Mount, Base Part Number:IDT70V07, Package / Case:TQFP, Number of Terminations:80, 70V07S25PF pinout, 70V07S25PF datasheet PDF, 70V07S25PF amp .Beyond Memory Intersil (Renesas Electronics Corporation) 70V07S25PF ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 70V07S25PF


Memory Intersil (Renesas Electronics Corporation) 70V07S25PF Overview

The Memory Intersil (Renesas Electronics Corporation) 70V07S25PF is a high-performance 256Kbit SRAM designed in a compact 80TQFP package, engineered for advanced parallel communication. This product caters to the needs of high-speed applications requiring a reliable temporary storage mechanism. The integration of leading-edge technology by Intersil, now part of Renesas Electronics Corporation, ensures low power consumption while maintaining fast access times, making it an ideal choice for enhancing the performance and efficiency of embedded systems.

70V07S25PF Features

The 70V07S25PF boasts several key features that make it a robust choice for various demanding applications. These include a large 256Kbit capacity for substantial data handling, a parallel interface for high-speed data transfer, and a compact 80TQFP package that fits seamlessly into space-constrained applications. Additionally, the device's design focuses on low power operation to extend the life of battery-powered devices.

70V07S25PF Applications

  • Telecommunications Equipment: Utilized for buffering data in routers and switches, enhancing the efficiency and speed of data traffic management.
  • Industrial Control Systems: Acts as a fast-access data buffer in complex machinery controllers, enabling quicker processing and response times in automation processes.
  • Automotive Electronics: Integrated into automotive infotainment systems to provide rapid access to media and navigation data, improving user experience and system responsiveness.
  • Portable Devices: Employed in mobile devices where power efficiency and space-saving are crucial, helping to optimize performance and extend battery life.
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