709279L12PF8

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Mfr.Part #
709279L12PF8
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
TQFP
Datasheet
Download
Description
IC SRAM 512KBIT PARALLEL 100TQFP
Stock
40,175
In Stock :
40,175

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Published :
2009
Terminal Position :
QUAD
Time@Peak Reflow Temperature-Max (s) :
20
Min Operating Temperature :
0°C
Base Part Number :
IDT709279
Terminal Pitch :
0.5mm
Memory Type :
RAM, SDR, SRAM
Standby Current-Max :
0.005A
Packaging :
Tape and Reel (TR)
Width :
14mm
Interface :
Parallel
Min Supply Voltage :
4.5V
I/O Type :
COMMON
Other Names :
IDT709279L12PF8 IDT709279L12PF8-ND
Number of Functions :
1
Terminal Form :
Gull wing
Radiation Hardening :
No
Voltage - Supply :
4.5 V ~ 5.5 V
Operating Supply Voltage :
5V
Max Operating Temperature :
70°C
Write Cycle Time - Word, Page :
--
Pin Count :
100
Factory Lead Time :
7 Weeks
Memory Interface :
Parallel
Mount :
Surface Mount
Temperature Grade :
COMMERCIAL
Mounting Type :
Surface Mount
Length :
14mm
Terminal Finish :
Tin/Lead (Sn85Pb15)
Operating Temperature :
0°C ~ 70°C (TA)
Density :
512 kb
Pbfree Code :
No
Number of Ports :
2
Height Seated (Max) :
1.6mm
Package / Case :
TQFP
Thickness :
1.4mm
RoHS Status :
RoHS Compliant
Nominal Supply Current :
305mA
Memory Format :
SRAM
Frequency :
33.3MHz
JESD-609 Code :
e0
Additional Feature :
FLOW-THROUGH OR PIPELINED ARCHITECTURE
Output Characteristics :
3-STATE
Number of Terminations :
100
Lead Free :
Contains Lead
Max Supply Voltage :
5.5V
Peak Reflow Temperature (Cel) :
240
Supply Voltage :
5V
Address Bus Width :
15b
Access Time :
12 ns
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Sync/Async :
SYNCHRONOUS
Memory Size :
64KB
Power Supplies :
5V
Supplier Device Package :
100-TQFP (14x14)
Word Size :
16b
Number of Pins :
100
Series :
--
Datasheets
709279L12PF8
Introducing Memory Intersil (Renesas Electronics Corporation) 709279L12PF8 from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:IDT709279, Mounting Type:Surface Mount, Operating Temperature:0°C ~ 70°C (TA), Package / Case:TQFP, Number of Terminations:100, Number of Pins:100, 709279L12PF8 pinout, 709279L12PF8 datasheet PDF, 709279L12PF8 amp .Beyond Memory Intersil (Renesas Electronics Corporation) 709279L12PF8 ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 709279L12PF8


Memory Intersil (Renesas Electronics Corporation) 709279L12PF8 Overview

Explore the innovative capabilities of the Memory Intersil (Renesas Electronics Corporation) 709279L12PF8, a cutting-edge IC SRAM 512KBIT PARALLEL housed in a 100TQFP package. Designed with meticulous precision and crafted for optimal performance, this product embodies reliability, efficiency, and versatility.

With a focus on meeting the demanding requirements of B2B clientele, this SRAM solution sets a new standard in memory technology. Its robust architecture ensures seamless integration into a wide range of applications, empowering businesses with the tools they need to excel in today's competitive landscape.

709279L12PF8 Features

  • High-Speed Operation: Experience lightning-fast data access and retrieval with this IC's impressive speed capabilities.
  • Large Capacity: With 512KBIT of memory, this SRAM provides ample storage for critical data and information.
  • Parallel Interface: Facilitating efficient communication, the parallel interface enhances connectivity and throughput.
  • Compact Form Factor: The 100TQFP package ensures space-saving design without compromising performance.
  • Reliable Performance: Built to withstand rigorous operational demands, this IC delivers consistent and reliable performance.

709279L12PF8 Applications

  • Industrial Automation: Implement reliable data storage and retrieval mechanisms in industrial automation systems for enhanced efficiency and productivity.
  • Telecommunications Infrastructure: Power telecommunications infrastructure with high-speed data processing capabilities, ensuring seamless communication networks.
  • Medical Devices: Enhance the functionality of medical devices such as patient monitoring systems with secure and efficient data storage solutions.
  • Automotive Electronics: Enable advanced features in automotive electronics, including navigation systems and driver assistance technologies, with reliable memory storage.
  • Consumer Electronics: Elevate the performance of consumer electronics devices such as gaming consoles and smart appliances with high-speed memory solutions.
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Shipping Cost

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