7006L20PF
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- Mfr.Part #
- 7006L20PF
- Manufacturer
- Intersil (Renesas Electronics Corporation)
- Package / Case
- TQFP
- Datasheet
- Download
- Description
- IC SRAM 128KBIT PARALLEL 64TQFP
- Stock
- 42,526
- In Stock ：
- 42,526
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- Manufacturer :
- Intersil (Renesas Electronics Corporation)
- Product Category :
- Memory
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Base Part Number :
- IDT7006
- Mounting Type :
- Surface Mount
- Operating Supply Voltage :
- 5V
- Memory Format :
- SRAM
- Memory Type :
- RAM, SDR, SRAM
- Series :
- --
- Memory Size :
- 16kB
- Standby Voltage-Min :
- 2V
- Height Seated (Max) :
- 1.6mm
- Supplier Device Package :
- 64-TQFP (14x14)
- Mount :
- Surface Mount
- Min Supply Voltage :
- 4.5V
- Interface :
- Parallel
- Address Bus Width :
- 28b
- Supply Voltage :
- 5V
- Power Supplies :
- 5V
- Packaging :
- Tray
- I/O Type :
- COMMON
- Radiation Hardening :
- No
- JESD-609 Code :
- e0
- Terminal Finish :
- Tin/Lead (Sn85Pb15)
- Number of Pins :
- 64
- Length :
- 14mm
- Word Size :
- 8B
- Sync/Async :
- ASYNCHRONOUS
- Nominal Supply Current :
- 320mA
- Width :
- 14mm
- Temperature Grade :
- Industrial
- Voltage - Supply :
- 4.5 V ~ 5.5 V
- Terminal Position :
- QUAD
- Write Cycle Time - Word, Page :
- 20ns
- Operating Temperature :
- -40°C ~ 85°C (TA)
- Time@Peak Reflow Temperature-Max (s) :
- 20
- Max Operating Temperature :
- 85°C
- Access Time :
- 20 ns
- Additional Feature :
- INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
- Standby Current-Max :
- 0.004A
- Memory Interface :
- Parallel
- Number of Ports :
- 2
- Pin Count :
- 64
- Pbfree Code :
- No
- Factory Lead Time :
- 7 Weeks
- ECCN Code :
- EAR99
- Organization :
- 16KX8
- Min Operating Temperature :
- -40°C
- Thickness :
- 1.4mm
- Package / Case :
- TQFP
- Max Supply Voltage :
- 5.5V
- Published :
- 2008
- Density :
- 128 kb
- Terminal Form :
- Gull wing
- Number of Functions :
- 1
- Lead Free :
- Contains Lead
- Output Characteristics :
- 3-STATE
- Peak Reflow Temperature (Cel) :
- 240
- Number of Terminations :
- 64
- Terminal Pitch :
- 0.8mm
- RoHS Status :
- RoHS Compliant
- Datasheets
- 7006L20PF
Memory Intersil (Renesas Electronics Corporation) 7006L20PF Overview
The Memory Intersil (Renesas Electronics Corporation) 7006L20PF is a high-performance IC SRAM designed to meet the demanding requirements of high-speed data processing and storage. This integrated circuit features a robust 128KBIT capacity structured in a parallel configuration, making it ideally suited for applications requiring fast access and high reliability. Housed in a compact 64TQFP package, it offers a perfect blend of form factor and functionality, ensuring optimal integration into a variety of system architectures. The inclusion of advanced manufacturing technology from Intersil (Renesas Electronics Corporation) enhances its performance stability and operational longevity, making it a top choice for B2B customers looking to bulk purchase reliable memory solutions.
7006L20PF Features
The 7006L20PF SRAM chip boasts several key features that make it a standout choice for system designers and engineers. These include its parallel interface, which allows for rapid data transfer rates and ease of integration into existing architectures. Additionally, its low power consumption makes it ideal for applications where efficiency is crucial. The 64TQFP packaging not only provides a compact solution but also offers excellent thermal performance, further enhancing the chip's reliability under varied operating conditions.
7006L20PF Applications
- Telecommunications Equipment: Utilized in routers and switches for buffering data, helping to manage the flow of information and maintain system integrity under high traffic conditions.
- Automotive Electronics: Acts as temporary data storage for advanced driver-assistance systems (ADAS), supporting real-time processing and decision-making.
- Industrial Automation: Facilitates process control by storing program variables and real-time data, enabling quick access and response in automated production lines.
- Consumer Electronics: Integrated into devices such as digital cameras and gaming consoles, where fast access to temporary data enhances user experience and device functionality.
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