637-062-632-263
- Mfr.Part #
- 637-062-632-263
- Manufacturer
- EDAC Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN D-SUB HD PLUG 62P SLDR CUP
- Stock
- 39,501
- In Stock :
- 39,501
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- Manufacturer :
- EDAC Inc.
- Product Category :
- D-Sub Connector Assemblies
- Contact Finish Thickness :
- 30.0µin (0.76µm)
- Features :
- Grounding Indents, Shielded
- Shell Size, Connector Layout :
- 4 (DC, C) High Density
- Contact Finish :
- Gold
- Package :
- Tray
- Material Flammability Rating :
- UL94 V-0
- Brand :
- EDAC
- Contact Material :
- Brass
- Voltage Rating :
- -
- Product Type :
- High Density D-Sub Connectors
- Product Category :
- D-Sub High Density Connectors
- Number of Rows :
- 3
- Manufacturer :
- Cutler Hammer, Div of Eaton Co
- Backset Spacing :
- -
- Base Product Number :
- 637-062
- Wire Gauge :
- -
- Mounting Type :
- Free Hanging (In-Line)
- Connector Style :
- D-Sub, High Density
- Contact Type :
- Signal
- Series :
- 637
- Current Rating (Amps) :
- 3A per Contact
- Termination :
- Solder Cup
- Flange Feature :
- Mating Side, Female Screwlock (4-40)
- Approvals :
- CSA, UL
- Connector Type :
- Plug, Male Pins
- Color :
- Black
- Subcategory :
- D-Sub Connectors
- Ingress Protection :
- -
- Operating Temperature :
- -55°C ~ 125°C
- Product Status :
- Active
- Dielectric Material :
- Polyester Thermoplastic
- Contact Form :
- -
- Shell Material, Finish :
- Steel, Tin Plated
- Number of Positions :
- 62
- Current Rating :
- 125 A
- Datasheets
- 637-062-632-263

637 Series D-Sub, High Density Plug, Male Pins 62-Position Signal Solder Cup 4 (DC, C) High Density Free Hanging (In-Line) Brass Gold Steel, Tin Plated
637-062-632-263 Overview
It comes in Plug, Male Pins packaging.There is a mounting type of Free Hanging (In-Line) for this device.This product is part of the 637 Series.In this case, the device operates at -55°C ~ 125°C Operating Temperature.
637-062-632-263 Features
637 series
637-062-632-263 Applications
There are a lot of EDAC
637-062-632-263 D-Sub Connectors applications.
- Transportation
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
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