23LC512-E/SN
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- Mfr.Part #
- 23LC512-E/SN
- Manufacturer
- Microchip Technology
- Package / Case
- 8-SOIC (0.154, 3.90mm Width)
- Datasheet
- Download
- Description
- IC SRAM 512KBIT SPI/QUAD 8SOIC
- Stock
- 14,512
- In Stock ：
- 14,512
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- Manufacturer :
- Microchip Technology
- Product Category :
- Memory
- Memory Interface :
- SPI - Quad I/O
- Number of Terminations :
- 8
- Package :
- Tube
- Packaging :
- Tube
- Width :
- 3.9mm
- Temperature Grade :
- Automotive
- Manufacturer :
- Microchip Technology Inc
- Memory Organization :
- 64K x 8
- Memory IC Type :
- STANDARD SRAM
- Terminal Form :
- Gull wing
- Factory Lead Time :
- 19 Weeks
- Memory Format :
- SRAM
- Surface Mount :
- yes
- Memory Width :
- 8
- Voltage - Supply :
- 2.5V~5.5V
- Memory Size :
- 512Kb 64K x 8
- Number of Functions :
- 1
- Operating Mode :
- SYNCHRONOUS
- Organization :
- 64KX8
- Supply Voltage-Min (Vsup) :
- 2.5V
- Supply Voltage-Max (Vsup) :
- 5.5V
- Series :
- --
- Base Product Number :
- 23LC512
- Screening Level :
- TS 16949
- Memory Type :
- Volatile
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Height Seated (Max) :
- 1.75mm
- Clock Frequency :
- 16MHz
- Mounting Type :
- Surface Mount
- Terminal Finish :
- Matte Tin (Sn) - annealed
- Access Time :
- 32 ns
- Interface Type :
- SDI, SPI, SQI
- Terminal Position :
- Dual
- Terminal Pitch :
- 1.27mm
- Parallel/Serial :
- Serial
- Maximum Operating Temperature :
- + 125 C
- RoHS Status :
- ROHS3 Compliant
- Supply Voltage :
- 5V
- Number of Words :
- 65536 words
- Number of Terminals :
- 8
- Base Part Number :
- 23LC512
- Product Status :
- Active
- Minimum Operating Temperature :
- - 40 C
- Published :
- 2012
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Write Cycle Time - Word, Page :
- --
- Length :
- 4.9mm
- Package / Case :
- 8-SOIC (0.154, 3.90mm Width)
- Peak Reflow Temperature (Cel) :
- 260
- Seated Height-Max :
- 1.75 mm
- Memory Density :
- 524288 bit
- Operating Temperature :
- -40°C~125°C TA
- Mounting Style :
- SMD/SMT
- JESD-30 Code :
- R-PDSO-G8
- Reach Compliance Code :
- Compliant
- Package Shape :
- RECTANGULAR
- JESD-609 Code :
- e3
- Supplier Device Package :
- 8-SOIC
- Datasheets
- 23LC512-E/SN
Memory Microchip Technology 23LC512-E/SN Overview
Delve into the advanced storage capabilities of the Memory Microchip Technology 23LC512-E/SN, a leading IC SRAM product designed and manufactured by the esteemed Microchip Technology. This high-performance 512Kbit Serial SRAM incorporates a versatile SPI/Quad interface in an 8SOIC package, offering swift and reliable data storage solutions. Designed for high-speed applications where low-power and compact design are crucial, the 23LC512-E/SN excels in a variety of challenging environments. Its durability, combined with Microchip's reputation for producing robust integrated circuits, makes it an outstanding choice for engineers and designers looking to incorporate a high-quality memory component into their designs. From its flexible interface options to its significant storage capacity, this SRAM module represents a balance of efficiency and performance, setting a benchmark in the semiconductor industry for both reliability and innovation.
23LC512-E/SN Features
- 512Kbit memory capacity providing ample storage for application data
- SPI/Quad interface ensures fast data transfer rates and simple integration
- 8-pin SOIC package allows for a compact footprint on printed circuit boards
- Low-power operation to optimize battery life in portable applications
- Stable data retention and high reliability characteristic of Microchip Technology's products
23LC512-E/SN Applications
- Data Logging Devices: Offers ample storage for regular collection of data from sensors and instruments.
- Gaming Systems: Provides fast access to frequently updated data, enhancing gaming performance.
- Industrial Control Systems: Reliable storage ensures smooth operation in automation and monitoring tasks.
- Medical Equipment: Stores critical data securely in devices that require high reliability and accuracy.
- Internet of Things (IoT) Gadgets: Serves as a flexible data buffer component for connected smart devices.
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