23A1024-E/ST

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Mfr.Part #
23A1024-E/ST
Manufacturer
Microchip Technology
Package / Case
8-TSSOP (0.173, 4.40mm Width)
Datasheet
Download
Description
IC SRAM 1MBIT SPI/QUAD 8TSSOP
Stock
6,317
In Stock :
6,317

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Manufacturer :
Microchip Technology
Product Category :
Memory
I/O Type :
COMMON/SEPARATE
Package :
Tube
Reach Compliance Code :
Compliant
Standby Current-Max :
0.000012A
Reverse Pinout :
No
Qualification Status :
Not Qualified
Mounting Type :
Surface Mount
JESD-609 Code :
e3
Width :
3mm
Time@Peak Reflow Temperature-Max (s) :
40
Product Category :
SRAM
Package / Case :
8-TSSOP (0.173, 4.40mm Width)
Memory Size :
1Mb 128K x 8
Supplier Device Package :
8-TSSOP
Peak Reflow Temperature (Cel) :
260
Power Supplies :
1.8/2V
Length :
4.4mm
Product Status :
Active
Memory Interface :
SPI - Quad I/O
Brand :
Microchip Technology / Atmel
Number of Functions :
1
Write Cycle Time - Word, Page :
--
Supply Voltage-Min (Vsup) :
1.7V
Supply Voltage-Max (Vsup) :
2.2V
Memory Format :
SRAM
Terminal Form :
Gull wing
Base Product Number :
23A1024
Memory IC Type :
STANDARD SRAM
Clock Frequency :
16MHz
Output Enable :
No
Temperature Grade :
Automotive
Minimum Operating Temperature :
- 40 C
Number of Terminations :
8
Subcategory :
Memory and Data Storage
Height Seated (Max) :
1.2mm
Manufacturer :
Microchip
Operating Mode :
SYNCHRONOUS
JESD-30 Code :
R-PDSO-G8
Access Time :
32 ns
Mounting Style :
SMD/SMT
Memory Type :
Volatile
Base Part Number :
23A1024
RoHS :
Details
Package Shape :
RECTANGULAR
Interface Type :
SDI, SPI, SQI
RoHS Status :
ROHS3 Compliant
Series :
--
Voltage - Supply :
1.7V~2.2V
Organization :
128KX8
Standby Voltage-Min :
1.7V
Product Type :
SRAM
Number of Words :
131072 words
Memory Density :
1048576 bit
Parallel/Serial :
Serial
Factory Lead Time :
5 Weeks
Access Time (Max) :
32 ns
Memory Width :
8
Supply Current-Max :
0.01 mA
Packaging :
Tube
Number of Terminals :
8
Output Characteristics :
3-STATE
Memory Organization :
128K x 8
Terminal Finish :
Matte Tin (Sn) - annealed
Operating Temperature :
-40°C~125°C TA
Type :
SYNCHRONOUS
Surface Mount :
yes
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Maximum Operating Temperature :
+ 125 C
Seated Height-Max :
1.2 mm
Terminal Position :
Dual
Terminal Pitch :
0.65mm
Published :
2012
Datasheets
23A1024-E/ST
Introducing Memory Microchip Technology 23A1024-E/ST from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:8-TSSOP (0.173, 4.40mm Width), Number of Terminations:8, Base Part Number:23A1024, Operating Temperature:-40°C~125°C TA, Type:SYNCHRONOUS, 23A1024-E/ST pinout, 23A1024-E/ST datasheet PDF, 23A1024-E/ST amp .Beyond Memory Microchip Technology 23A1024-E/ST ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology 23A1024-E/ST


Memory Microchip Technology 23A1024-E/ST Overview

Introducing the exemplary Memory Microchip Technology 23A1024-E/ST, a highly reliable SRAM chip that delivers exceptional performance for a wide range of applications. Designed and manufactured by the esteemed Microchip Technology, this Integrated Circuit (IC) is engineered to cater to advanced electronic systems requiring a fast and stable memory solution. With a substantial 1Mbit of storage capacity, this IC boasts an SPI/QUAD interface encapsulated in a compact 8TSSOP form factor. It stands out for its robustness and versatility, meeting the demanding requirements of modern technology while ensuring ease of integration into system designs.

23A1024-E/ST Features

  • SPI/QUAD interface enhancing communication speeds with microcontrollers
  • Ample 1Mbit storage space for complex operations
  • Energy-efficient design enabling optimal battery usage in portable devices
  • 8TSSOP package allowing for a minimal footprint in space-constrained applications
  • Extended temperature range suited for operation in harsh environments

23A1024-E/ST Applications

  • Industrial Control Systems: Deployed as data logging memory to capture high-speed operations and system states.
  • Consumer Electronics: Enhances user experience by providing swift access to settings and preferences stored in memory.
  • Communications Equipment: Utilized for buffering data during transmission, ensuring smooth and reliable communications.
  • Automotive Electronics: Stores critical data for engine management systems and in-vehicle infotainment units.
  • Portable Devices: Makes the most of its energy-efficient feature for prolonging battery life while offering ample data storage.
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