1ST280EY3F55I3XG

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Mfr.Part #
1ST280EY3F55I3XG
Manufacturer
Altera (Intel)
Package / Case
2912-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 296 I/O 2912BGA
Stock
12,287
In Stock :
12,287

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Number of Logic Elements/Cells :
2800000
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Operating Temperature :
-40°C~100°C TJ
Number of LABs/CLBs :
350000
Package / Case :
2912-BBGA, FCBGA
Factory Lead Time :
12 Weeks
Mounting Type :
Surface Mount
Number of I/O :
296
Voltage - Supply :
0.82V~0.88V
Series :
Stratix® 10 TX
Datasheets
1ST280EY3F55I3XG
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 1ST280EY3F55I3XG from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Package / Case:2912-BBGA, FCBGA, Mounting Type:Surface Mount, 1ST280EY3F55I3XG pinout, 1ST280EY3F55I3XG datasheet PDF, 1ST280EY3F55I3XG amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 1ST280EY3F55I3XG ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 1ST280EY3F55I3XG


FPGAs Altera (Intel) 1ST280EY3F55I3XG Overview

The FPGAs Altera (Intel) 1ST280EY3F55I3XG is a high-performance integrated circuit specifically designed for advanced digital processing tasks. This FPGA from Intel's Altera division boasts a robust 2912-ball grid array (BGA) packaging, ensuring high-density integration and superior reliability. Designed to cater to the demanding requirements of modern electronic applications, this device offers flexibility in design adjustments and rapid prototyping capabilities. With its substantial I/O capability of 296 pins, this FPGA can manage multiple inputs and outputs, making it an excellent choice for complex digital systems requiring high-speed data processing and extensive connectivity.

1ST280EY3F55I3XG Features

The 1ST280EY3F55I3XG FPGA offers several key features that make it an attractive option for developers and engineers. These include a large array of programmable logic elements, which allow for highly customized digital functions and algorithms. The device's high I/O count supports extensive peripheral integrations and data throughput, crucial for applications involving high-speed communications or complex interfacing requirements. Additionally, the BGA packaging helps achieve reduced latency and improved heat dissipation, which is vital for maintaining performance in high-demand scenarios.

1ST280EY3F55I3XG Applications

  • Telecommunications Infrastructure: Utilized in routers and switches, the FPGA improves data packet processing speeds and enhances connectivity options.
  • Data Centers: Serves as the backbone for server management and network traffic control, ensuring efficient operations and reliability in cloud services and data storage.
  • Automotive Technology: Integral in advanced driver-assistance systems (ADAS), this FPGA handles real-time sensor data processing, contributing to safer driving experiences.
  • Medical Devices: Applied in imaging systems like MRI and ultrasound, the FPGA enables fast and accurate data processing, leading to better diagnostic capabilities.
  • Consumer Electronics: Enhances performance in devices such as high-definition televisions and gaming consoles, offering superior user experiences through high-speed video processing.
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