1ST280EY3F55E3VG

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Mfr.Part #
1ST280EY3F55E3VG
Manufacturer
Altera (Intel)
Package / Case
2912-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 296 I/O 2912BGA
Stock
9,799
In Stock :
9,799

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Package / Case :
2912-BBGA, FCBGA
Voltage - Supply :
0.77V~0.97V
Number of Logic Elements/Cells :
2800000
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Operating Temperature :
0°C~100°C TJ
Factory Lead Time :
12 Weeks
Number of I/O :
296
Series :
Stratix® 10 TX
Mounting Type :
Surface Mount
Number of LABs/CLBs :
350000
Datasheets
1ST280EY3F55E3VG
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 1ST280EY3F55E3VG from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:2912-BBGA, FCBGA, Operating Temperature:0°C~100°C TJ, Mounting Type:Surface Mount, 1ST280EY3F55E3VG pinout, 1ST280EY3F55E3VG datasheet PDF, 1ST280EY3F55E3VG amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 1ST280EY3F55E3VG ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 1ST280EY3F55E3VG


FPGAs Altera 1ST280EY3F55E3VG Overview

The FPGAs Altera 1ST280EY3F55E3VG by Intel is a state-of-the-art integrated circuit designed for applications requiring high levels of logic integration and flexibility. This IC FPGA features a robust 2912-pin BGA (Ball Grid Array) package, ensuring substantial I/O capabilities with a total of 296 I/O pins. Engineered for versatility and high performance, this FPGA is ideal for developers looking to push the boundaries of technology in various demanding environments. Its extensive configurability allows for rapid prototyping and customization, making it a cornerstone in the development of complex digital circuits.

1ST280EY3F55E3VG Features

This FPGA from Intel’s Altera division boasts significant attributes that enhance its utility across various applications. The 1ST280EY3F55E3VG includes a high pin count which facilitates extensive interfacing options, while the advanced 2912BGA packaging ensures optimal reliability and connectivity. With its considerable logic resource allocation, it supports intricate digital designs and can efficiently handle multiple functionalities simultaneously.

1ST280EY3F55E3VG Applications

  • Data Centers: Utilized in server infrastructure to manage and speed up data processing tasks, enhancing overall efficiency and performance.
  • Telecommunications: Employed in communications infrastructure for signal processing, supporting increased data throughput and improved network reliability.
  • Automotive Systems: Integral in advanced driver-assistance systems (ADAS) to process real-time data from vehicle sensors, improving safety and driving dynamics.
  • Industrial Automation: Used in control systems to perform complex computations for machinery management, optimizing operational precision and productivity.
  • Consumer Electronics: Deployed in smart home devices and entertainment systems to enhance user interfaces and multimedia processing capabilities.
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