1N6109AUS

Manufacturer :

Microchip Technology

Product Category :

Case Connection :

Isolated

Reverse Standoff Voltage :

9.9V

Leakage Current :

20μA

RoHS Status :

Non-RoHS Compliant

Peak Pulse Power :

500W

Polarity :

Bidirectional

Voltage - Reverse Standoff (Typ) :

9.9V

Radiation Hardening :

yes

Mount :

Surface Mount

Applications :

GENERAL PURPOSE

Direction :

Bidirectional

Package / Case :

SQ-MELF, B

Contact Plating :

Lead, Tin

Clamping Voltage :

18.2V

Type :

Zener

Number of Pins :

2

JESD-609 Code :

e0

Packaging :

Bulk

Operating Temperature :

-55°C~175°C TJ

Number of Elements :

1

Test Current :

100mA

Terminal Finish :

TIN LEAD

Diode Element Material :

SILICON

Power Line Protection :

No

Additional Feature :

High Reliability

Terminal Form :

WRAP AROUND

Lifecycle Status :

IN PRODUCTION (Last Updated: 1 month ago)

Current - Peak Pulse (10/1000μs) :

27.5A

Published :

1997

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Pin Count :

2

Pbfree Code :

No

Terminal Position :

END

Element Configuration :

Single

Peak Pulse Current :

27.5A

Power Dissipation-Max :

2W

Max Reverse Leakage Current :

20μA

Number of Terminations :

2

Factory Lead Time :

17 Weeks

ECCN Code :

EAR99

Reverse Breakdown Voltage :

12.35V

Mounting Type :

Surface Mount