18-823-90C
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- Mfr.Part #
- 18-823-90C
- Manufacturer
- Aries Electronics, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN IC DIP SOCKET 18POS GOLD
- Stock
- 33,494
- In Stock ：
- 33,494
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- Manufacturer :
- Aries Electronics, Inc.
- Product Category :
- IC Sockets
- Mating Contact Pitch :
- 0.1 inch
- Termination Post Length :
- 0.140 3.56mm
- Pitch - Mating :
- 0.100 2.54mm
- Mount :
- Horizontal, Through Hole
- Terminal Pitch :
- 2.54mm
- Material Flammability Rating :
- UL94 V-0
- Housing Material :
- Polyamide (PA46), Nylon 4/6, Glass Filled
- Lead Length :
- 3.556mm
- PCB Contact Pattern :
- RECTANGULAR
- Contact Finish - Mating :
- Gold
- Number of Positions or Pins (Grid) :
- 18 (2 x 9)
- Published :
- 2006
- Contact Material - Mating :
- BERYLLIUM COPPER
- Number of Positions :
- 18
- Type :
- DIP, 0.3 (7.62mm) Row Spacing
- Additional Feature :
- STANDARD: UL 94V-0
- Body Breadth :
- 0.4 inch
- Mounting Type :
- Through Hole, Right Angle, Horizontal
- Packaging :
- Bulk
- JESD-609 Code :
- e4
- Series :
- Vertisockets™ 800
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Contact Finish - Post :
- Tin
- Flammability Rating :
- UL94 V-0
- Body Depth :
- 0.528 inch
- Feature :
- Closed Frame
- Number of Contacts :
- 18
- Contact Style :
- RND PIN-SKT
- RoHS Status :
- ROHS3 Compliant
- Contact Finish Thickness - Mating :
- 30.0μin 0.76μm
- Current Rating :
- 3A
- Contact Material - Post :
- Brass
- Body Length or Diameter :
- 0.9 inch
- Factory Lead Time :
- 6 Weeks
- Termination :
- Solder
- Operating Temperature :
- -55°C~105°C
- ECCN Code :
- EAR99
- Pitch - Post :
- 0.100 2.54mm
- Contact Finish Thickness - Post :
- 200.0μin 5.08μm
- PCB Contact Row Spacing :
- 0.3 mm
- Datasheets
- 18-823-90C
18-823-90C datasheet pdf and Sockets for ICs, Transistors product details from Aries Electronics stock available at Xinshop
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