146893-1

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Mfr.Part #
146893-1
Manufacturer
TE Connectivity AMP Connectors
Package / Case
TSSOP
Datasheet
Download
Description
CONN RCPT 64POS SMD GOLD
Stock
1,300
In Stock :
1,300

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Manufacturer :
TE Connectivity AMP Connectors
Product Category :
Arrays, Edge Type, Mezzanine (Board to Board)
Filter Feature :
No
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Contact Finish Thickness :
30.0μin 0.76μm
RoHS Status :
Non-RoHS Compliant
Mounting Type :
Surface Mount
Length - Tail :
2.0574mm
Height Above Board :
0.211 5.35mm
Pitch :
0.039 1.00mm
JESD-609 Code :
e0
Series :
Free Height (FH) IEEE 1386, PMC
Number Of PCB Rows :
2
Connector Type :
Receptacle, Outer Shroud Contacts
Contact Finish :
Gold
Pbfree Code :
No
Rated Current (Signal) :
0.8A
Lifecycle Status :
ACTIVE (Last Updated: 2 days ago)
Max Operating Temperature :
230°C
Contact Material :
Bronze
Number of Conductors :
ONE
Stack Height :
10.0076mm
Plating Thickness :
3.81μm
Package / Case :
TSSOP
Contact Pattern :
RECTANGULAR
Termination :
SMD/SMT
Feature :
Board Guide
Contact Style :
CENTRONIC
Polarization Key :
POLARIZED HOUSING
Depth :
6.05mm
Height :
5.3594mm
Durability :
100 Cycles
Differential Signaling :
yes
Operating Supply Voltage :
250V
PCB Mount Alignment :
With
Data Rate :
400 Mbps
Number of Rows :
2
Option :
GENERAL PURPOSE
Radiation Hardening :
No
Length :
34.22mm
Total Number of Contacts :
64
Stack Height (Mating) :
8mm 9mm 10mm
Max Voltage Rating (AC) :
100V
Contact Finish Thickness - Mating :
759.99848 nm
IEC Conformance :
No
Underplate Material :
Nickel
DIN Conformance :
No
Contact Current Rating :
1A
Packaging :
Tape and Reel (TR)
Reliability :
COMMERCIAL
ECCN Code :
EAR99
HTS Code :
8536.69.40.40
Mating Information :
MULTIPLE MATING PARTS AVAILABLE
Flammability Rating :
UL94 V-0
Mount :
Surface Mount
Published :
2009
Number of Positions :
64
ELV :
Compliant
MIL Conformance :
No
Housing Material :
Thermoplastic
Width :
6.04mm
Mating Alignment :
Without
Housing Color :
Black
Contact Gender :
FEMALE
Min Operating Temperature :
-67°C
Number of Columns :
32
Insulation Resistance :
2MOhm
PCB Contact Pattern :
RECTANGULAR
Orientation :
Vertical
Factory Lead Time :
19 Weeks
Row Spacing :
1 mm
Mixed Contacts :
No
Approval Agency :
CSA
Datasheets
146893-1
Introducing Arrays, Edge Type, Mezzanine (Board to Board) TE Connectivity AMP Connectors 146893-1 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:TSSOP, 146893-1 pinout, 146893-1 datasheet PDF, 146893-1 amp .Beyond Arrays, Edge Type, Mezzanine (Board to Board) TE Connectivity AMP Connectors 146893-1 ,we also offer 5054761010, 5035481222, AXT510124, Our vast inventory has you covered. Contact us now for immediate solutions.

TE Connectivity AMP Connectors 146893-1


Receptacle, Outer Shroud Contacts Tape & Reel (TR) 2 Rows 0.039 1.00mm Surface Mount 64 Positions Free Height (FH) IEEE 1386, PMC Gold SMD/SMT Bronze

146893-1 Overview


Currently, it is packaged in Receptacle, Outer Shroud Contacts.A Tape & Reel (TR) case is used to package the product.The mounting type of the device is Surface Mount.A product of the Free Height (FH) IEEE 1386, PMC Series, it belongs to the range of products of that series.The operating system can be configured to maintain the value of Board Guide when it operates.Using a Surface Mount socket is required in order to mount the item.A temperature below 230°C is best for using it.The device must run at -67°C degrees.As this device is suitable for the operation with a 250V supply, it should be used with that supply.TSSOP means there is a device enclosed in the packaging.

146893-1 Features


Free Height (FH) IEEE 1386, PMC series
Package / Case: Tape & Reel (TR)
Mounting Type:Surface Mount
Max Operating temperature at -67°C


146893-1 Applications


There are a lot of TE Connectivity AMP Connectors
146893-1 Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology
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