10M08DFV81C8GES

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Mfr.Part #
10M08DFV81C8GES
Manufacturer
Altera (Intel)
Package / Case
81-UFBGA, WLCSP
Datasheet
Download
Description
IC FPGA 56 I/O 81WLCSP
Stock
8,519
In Stock :
8,519

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Total RAM Bits :
387072
Series :
MAX® 10
Mounting Type :
Surface Mount
Packaging :
Tray
Operating Temperature :
0°C~85°C TJ
Voltage - Supply :
1.15V~1.25V
RoHS Status :
RoHS Compliant
Number of LABs/CLBs :
500
Package / Case :
81-UFBGA, WLCSP
Number of I/O :
56
Number of Logic Elements/Cells :
8000
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Datasheets
10M08DFV81C8GES
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 10M08DFV81C8GES from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, Package / Case:81-UFBGA, WLCSP, 10M08DFV81C8GES pinout, 10M08DFV81C8GES datasheet PDF, 10M08DFV81C8GES amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 10M08DFV81C8GES ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 10M08DFV81C8GES


FPGAs (Field Programmable Gate Array) Altera (Intel) 10M08DFV81C8GES Overview

The FPGAs (Field Programmable Gate Array) Altera (Intel) 10M08DFV81C8GES is a high-performance integrated circuit designed by Intel under the Altera brand. This compact FPGA features a 81-ball WLCSP (Wafer Level Chip Scale Package) that maximizes functionality while minimizing physical footprint, making it ideal for applications where space is at a premium. Known for its flexibility and efficiency, this device is equipped to handle a variety of digital signal processing and control tasks. The FPGA is optimized for low power consumption and provides a robust platform for developing complex designs in a compact form factor, perfect for a wide range of industrial applications.

10M08DFV81C8GES Features

This FPGA model boasts 56 user I/O pins, allowing for versatile connectivity options and integration into multiple system designs. The 81-ball WLCSP packaging is essential for creating more streamlined and compact device layouts, making it an excellent choice for modern electronic applications that require a balance of power and size. Additionally, its compatibility with Intel's sophisticated toolset supports enhanced productivity and innovation in FPGA programming and deployment.

10M08DFV81C8GES Applications

  • Consumer Electronics: Utilized in devices like smartwatches, gaming consoles, and portable media players, where space is limited and efficiency is critical.
  • Automotive Systems: Integrated into automotive subsystems for managing functions such as sensor data processing and real-time system control, enhancing vehicle performance and safety.
  • Industrial Automation: Deployed in control systems for manufacturing robots and assembly lines, offering the adaptability required for complex, precise operations.
  • Communication Infrastructure: Applied in network devices, including routers and switches, to manage data flow efficiently and support high-speed communication protocols.
  • Medical Devices: Incorporated into compact, portable medical diagnostics or treatment devices that require reliable, precise operations.
This structured description caters to B2B clients by highlighting key features and applicable scenarios where the FPGA can be effectively implemented, encouraging bulk purchases by demonstrating versatility and adaptability.
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