ZL50114GAG

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Mfr.Part #
ZL50114GAG
Manufacturer
Microchip Technology
Package / Case
552-BGA
Datasheet
Download
Description
IC TELECOM INTERFACE 552BGA
Stock
44,303
In Stock :
44,303

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Manufacturer :
Microchip Technology
Product Category :
Telecom
Product Status :
Active
Mount :
Surface Mount
Base Part Number :
ZL50114
Terminal Finish :
TIN SILVER COPPER
Operating Supply Current :
950mA
Product Type :
Telecom Interface ICs
Number of Terminals :
552
Voltage - Supply :
1.65V~1.95V
Telecom IC Type :
TELECOM CIRCUIT
Power Supplies :
1.8,3.3 V
Radiation Hardening :
No
Number of Circuits :
1
Series :
-
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Function :
TELECOM CIRCUIT
Length :
35mm
Published :
2009
Supplier Package :
BGA
Reach Compliance Code :
Compliant
RoHS Status :
ROHS3 Compliant
Surface Mount :
yes
Supply Voltage :
1.8V
Seated Height-Max :
2.53 mm
Transmission Media Type :
Fiber Optic Cable
Terminal Form :
Ball
Power Supply Type :
Analog
Maximum Data Rate :
1000 Mbps
Typical Operating Supply Voltage :
1.8000 V
Number of Functions :
1
Product Category :
Telecom Interface ICs
HTS Code :
8542.39.00.01
Mounting Type :
Surface Mount
Width :
35mm
Operating Supply Voltage :
1.8V
Temperature Grade :
Industrial
Data Rate :
1 Gbps
Terminal Pitch :
1.27 mm
Type :
CESoP Processor
Factory Lead Time :
8 Weeks
JESD-609 Code :
e1
Number of Pins :
552
Base Product Number :
ZL50114
Number of Terminations :
552
Brand :
Microchip Technology
Interface :
TDM
Manufacturer :
Microchip
Pin Count :
552
JESD-30 Code :
S-PBGA-B552
Terminal Position :
BOTTOM
Category :
CESoP Processor
Qualification Status :
Not Qualified
Package Shape :
Square
Mounting :
Surface Mount
Package / Case :
552-BGA
Packaging :
Tray
Maximum Operating Supply Voltage :
1.95 V
Package :
Tray
Minimum Operating Supply Voltage :
1.65 V
Current - Supply :
950mA
Height Seated (Max) :
2.53mm
RoHS :
Details
Operating Temperature :
-40°C~85°C
Supplier Device Package :
552-PBGA (35x35)
Datasheets
ZL50114GAG
Introducing Telecom Microchip Technology ZL50114GAG from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:ZL50114, Mounting Type:Surface Mount, Type:CESoP Processor, Number of Pins:552, Number of Terminations:552, Package / Case:552-BGA, Operating Temperature:-40°C~85°C, ZL50114GAG pinout, ZL50114GAG datasheet PDF, ZL50114GAG amp .Beyond Telecom Microchip Technology ZL50114GAG ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.



552 Terminations 1.8V 552 Pin ZL50114 Telecom device 1 Circuits 1 Functions

ZL50114GAG2 Overview


A 552-BGA package is used to reduce board space requirements.A Tray-packing method is used to pack telecommunications equipment.A Surface Mount-mount is used for mounting the telecom circuit.Telecom circuit is made up of 1 circuits.Providing 1.65V~1.95V wtelecom IC's efficiencyh the correct supply voltage will improve efficiency.A -40°C~85°C-temperature setting offers reliable performance.The mounting is in the way of Surface Mount.Configuration of this telecom circuit has 552 terminations.There is a voltage supply called 1.8V that it uses.The telecom interface has 552 pins.The ZL50114 base part number can be used to find more related parts.The type of telecom IC it uses is TELECOM CIRCUIT.An electric current of 950mA is supplied to telecom equipment .With the voltage of 1.8V as its supply voltage, designers have a great deal of flexibility.In addition to providing many benefits for designers, it operates using 950mA as a supply current.With the - series electronic parts, it can perform similar functions of the telecommunication product .While designing, telecommunications device has 1 functions configured.Its pin configuration is determined by 552 telecom product pins.

ZL50114GAG2 Features


Available in the 552-BGA package
TELECOM CIRCUIT as telecom IC type
Operating supply voltage of 1.8V
Operating supply current of 950mA


ZL50114GAG2 Applications


There are a lot of Microchip Technology
ZL50114GAG2 Telecom applications.


  • Fractional T1/E1/J1
  • BITS Timing
  • Digital Access Cross-connect System (DACs)
  • Digital Cross-connect Systems (DCS)
  • Frame Relay Switches and Access Devices (FRADS)
  • ISDN Primary Rate Interfaces (PRA)
  • PBXs channel bank
  • PCM channel bank
  • T3 channelized access concentrators
  • M13 MUX
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