ZL50057GAC

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Mfr.Part #
ZL50057GAC
Manufacturer
Microchip Technology
Package / Case
272-BBGA
Datasheet
Download
Description
IC TELECOM INTERFACE 272BGA
Stock
31,539
In Stock :
31,539

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Manufacturer :
Microchip Technology
Product Category :
Telecom
Length :
27mm
Number of Ports :
48
Series :
-
Supply Voltage :
1.8V
Mount :
Surface Mount
Package :
Tray
Terminal Pitch :
1.27mm
RoHS Status :
Non-RoHS Compliant
Peak Reflow Temperature (Cel) :
225
Supplier Device Package :
272-PBGA (27x27)
Interface :
-
Height Seated (Max) :
2.54mm
Packaging :
Tray
Width :
27mm
Number of Pins :
272
HTS Code :
8542.39.00.01
Function :
Switch
Base Product Number :
ZL50057
Time@Peak Reflow Temperature-Max (s) :
30
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Terminal Form :
Ball
JESD-609 Code :
e0
Package / Case :
272-BBGA
Pbfree Code :
No
Number of Terminations :
272
Terminal Finish :
TIN LEAD
Power Supplies :
1.83.3V
Mounting Type :
Surface Mount
Base Part Number :
ZL50057
Current - Supply :
240mA
Qualification Status :
Not Qualified
Voltage - Supply :
1.71V~1.89V
Published :
2007
Terminal Position :
BOTTOM
Operating Temperature :
-40°C~85°C
Product Status :
Obsolete
Operating Supply Current :
240mA
Datasheets
ZL50057GAC
Introducing Telecom Microchip Technology ZL50057GAC from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:272, Package / Case:272-BBGA, Number of Terminations:272, Mounting Type:Surface Mount, Base Part Number:ZL50057, Operating Temperature:-40°C~85°C, ZL50057GAC pinout, ZL50057GAC datasheet PDF, ZL50057GAC amp .Beyond Telecom Microchip Technology ZL50057GAC ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology ZL50057GAC


Telecom Microchip Technology ZL50057GAC Overview

The ZL50057GAC by Microchip Technology is a state-of-the-art Integrated Circuit designed specifically for advanced telecom interface applications. As a crucial component in telecommunication systems, this IC provides robust support for high-density networking requirements. Its architecture is tailored to enhance system reliability and performance, ensuring seamless operation in high-demand environments. The Telecom Microchip Technology ZL50057GAC is engineered to address the complex needs of modern telecommunications networks, offering a blend of efficiency and high capacity data handling capabilities, which are essential for bulk purchasing decisions in the B2B sector.

ZL50057GAC Features

The ZL50057GAC IC features a compact 272-BGA (Ball Grid Array) package, ensuring a reduced footprint while maintaining high functionality. It supports a wide array of telecom interfaces, making it versatile for various communication applications. Its design is optimized for low power consumption, which is crucial for maintaining system efficiency in large-scale telecom infrastructures. Additionally, its high integration level allows for reduced external component count, which simplifies system design and enhances reliability.

ZL50057GAC Applications

  • Network Switches and Routers: Utilized for managing data traffic efficiently in enterprise and carrier networks, the ZL50057GAC improves data throughput and reliability.
  • Telecommunication Infrastructure: Supports high-speed data transmission and connectivity solutions, crucial for modern telecom services.
  • Wireless Base Stations: Enhances signal processing capabilities and supports higher data rates for improved mobile communication.
  • VoIP Systems: Provides the necessary interfacing for voice over internet protocol technologies, ensuring clear and uninterrupted voice transmissions.
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Shipping Method

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Shipping Cost

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The basic freight (for package ≤0.5 KG ) depends on the time zones and countries

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