ZL50057GAC
- Mfr.Part #
- ZL50057GAC
- Manufacturer
- Microchip Technology
- Package / Case
- 272-BBGA
- Datasheet
- Download
- Description
- IC TELECOM INTERFACE 272BGA
- Stock
- 31,539
- In Stock :
- 31,539
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- Manufacturer :
- Microchip Technology
- Product Category :
- Telecom
- Length :
- 27mm
- Number of Ports :
- 48
- Series :
- -
- Supply Voltage :
- 1.8V
- Mount :
- Surface Mount
- Package :
- Tray
- Terminal Pitch :
- 1.27mm
- RoHS Status :
- Non-RoHS Compliant
- Peak Reflow Temperature (Cel) :
- 225
- Supplier Device Package :
- 272-PBGA (27x27)
- Interface :
- -
- Height Seated (Max) :
- 2.54mm
- Packaging :
- Tray
- Width :
- 27mm
- Number of Pins :
- 272
- HTS Code :
- 8542.39.00.01
- Function :
- Switch
- Base Product Number :
- ZL50057
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Terminal Form :
- Ball
- JESD-609 Code :
- e0
- Package / Case :
- 272-BBGA
- Pbfree Code :
- No
- Number of Terminations :
- 272
- Terminal Finish :
- TIN LEAD
- Power Supplies :
- 1.83.3V
- Mounting Type :
- Surface Mount
- Base Part Number :
- ZL50057
- Current - Supply :
- 240mA
- Qualification Status :
- Not Qualified
- Voltage - Supply :
- 1.71V~1.89V
- Published :
- 2007
- Terminal Position :
- BOTTOM
- Operating Temperature :
- -40°C~85°C
- Product Status :
- Obsolete
- Operating Supply Current :
- 240mA
- Datasheets
- ZL50057GAC

Telecom Microchip Technology ZL50057GAC Overview
The ZL50057GAC by Microchip Technology is a state-of-the-art Integrated Circuit designed specifically for advanced telecom interface applications. As a crucial component in telecommunication systems, this IC provides robust support for high-density networking requirements. Its architecture is tailored to enhance system reliability and performance, ensuring seamless operation in high-demand environments. The Telecom Microchip Technology ZL50057GAC is engineered to address the complex needs of modern telecommunications networks, offering a blend of efficiency and high capacity data handling capabilities, which are essential for bulk purchasing decisions in the B2B sector.
ZL50057GAC Features
The ZL50057GAC IC features a compact 272-BGA (Ball Grid Array) package, ensuring a reduced footprint while maintaining high functionality. It supports a wide array of telecom interfaces, making it versatile for various communication applications. Its design is optimized for low power consumption, which is crucial for maintaining system efficiency in large-scale telecom infrastructures. Additionally, its high integration level allows for reduced external component count, which simplifies system design and enhances reliability.
ZL50057GAC Applications
- Network Switches and Routers: Utilized for managing data traffic efficiently in enterprise and carrier networks, the ZL50057GAC improves data throughput and reliability.
- Telecommunication Infrastructure: Supports high-speed data transmission and connectivity solutions, crucial for modern telecom services.
- Wireless Base Stations: Enhances signal processing capabilities and supports higher data rates for improved mobile communication.
- VoIP Systems: Provides the necessary interfacing for voice over internet protocol technologies, ensuring clear and uninterrupted voice transmissions.
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The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
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