XS170P

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Mfr.Part #
XS170P
Manufacturer
Littelfuse
Package / Case
8-SMD, Gull Wing
Datasheet
Download
Description
IC TELECOM INTERFACE 8FLATPACK
Stock
25,203
In Stock :
25,203

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Manufacturer :
Littelfuse
Product Category :
Telecom
Supplier Device Package :
8-Flatpack
Number of Circuits :
2
Packaging :
Tube
RoHS Status :
RoHS Compliant
Interface :
--
Operating Temperature :
-40°C~85°C
Power (Watts) :
800mW
Termination :
Gull wing
Function :
Relay Switch
Mounting Type :
Surface Mount
Width :
6.35mm
Min Operating Temperature :
-40°C
Lead Free :
Lead Free
Additional Feature :
UL RECOGNIZED, HIGH RELIABILITY, CMOS COMPATIBLE
Series :
--
Forward Current-Max :
0.05 A
Voltage - Supply :
--
Configuration :
SINGLE WITH OPTOCOUPLER AC INPUT-TRANSISTOR OUTPUT
Throw Configuration :
SPST
Manufacturer :
IXYS Integrated Circuits Division
Reach Compliance Code :
Unknown
Published :
2001
Max Power Dissipation :
800mW
Length :
9.652mm
Current - Supply :
--
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Optoelectronic Device Type :
TRANSISTOR OUTPUT SSR
Package :
Tube
Max Operating Temperature :
85°C
Product Status :
Obsolete
Mount :
Surface Mount
HTS Code :
8541.40.95.00
Package / Case :
8-SMD, Gull Wing
Includes :
Optocoupler
Input Current :
50mA
Number of Elements :
1
Height :
2.159mm
Isolation Voltage-Max :
3750 V
Datasheets
XS170P
Introducing Telecom Littelfuse XS170P from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~85°C, Mounting Type:Surface Mount, Package / Case:8-SMD, Gull Wing, XS170P pinout, XS170P datasheet PDF, XS170P amp .Beyond Telecom Littelfuse XS170P ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.

Littelfuse XS170P


Telecom Littelfuse XS170P Overview

The Telecom Littelfuse XS170P IC is a high-performance telecom interface solution housed in an efficient 8-flatpack package. Designed to meet the rigorous demands of modern telecommunication systems, this integrated circuit ensures reliable operation and connectivity in a wide range of communication applications. Its compact form factor and advanced technology make the XS170P a preferred choice for developers and engineers seeking robust interface solutions. Emphasizing durability and functionality, the Telecom Littelfuse XS170P is an essential component for building sophisticated telecom networks that require high reliability and performance.

XS170P Features

The XS170P from Littelfuse stands out with its advanced features designed for superior telecom interface applications. These include high signal integrity, low power consumption, and enhanced data protection capabilities. Additionally, its small package design facilitates easier integration into space-constrained applications, making it an ideal choice for high-density telecom systems.

XS170P Applications

  • Telecommunication Networks: The XS170P is used in telecommunication networks to manage data flow and signal integrity, ensuring stable and reliable communication.
  • High-Speed Internet Services: Essential for broadband technologies, XS170P provides the necessary interface capabilities to handle high-speed data transmission and reception.
  • Wireless Infrastructure: It supports wireless communication infrastructure by facilitating the integration of robust and high-performance interface solutions.
  • Enterprise Systems: In enterprise systems, XS170P helps in maintaining system integrity and communication reliability, crucial for business operations.
This structured content provides a comprehensive overview, highlights key features, and discusses potential applications of the XS170P, making it a valuable resource for B2B customers looking to integrate this IC into their telecom-related products and systems.
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