XRT75L04DIV-F

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Mfr.Part #
XRT75L04DIV-F
Manufacturer
MaxLinear
Package / Case
176-LQFP
Datasheet
Download
Description
IC TELECOM INTERFACE 176TQFP
Stock
5,764
In Stock :
5,764

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Manufacturer :
MaxLinear
Product Category :
Telecom
Mounting Type :
Surface Mount
Voltage - Supply :
3.135V~3.465V
Function :
Line Interface Unit (LIU)
Operating Temperature :
-40°C~85°C
Interface :
LIU
Package / Case :
176-LQFP
Number of Circuits :
4
Packaging :
Tray
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Current - Supply :
450mA
Datasheets
XRT75L04DIV-F
Introducing Telecom MaxLinear XRT75L04DIV-F from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:-40°C~85°C, Package / Case:176-LQFP, XRT75L04DIV-F pinout, XRT75L04DIV-F datasheet PDF, XRT75L04DIV-F amp .Beyond Telecom MaxLinear XRT75L04DIV-F ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.

MaxLinear XRT75L04DIV-F


Telecom MaxLinear XRT75L04DIV-F Overview

The XRT75L04DIV-F by MaxLinear stands out in the telecom sector as a high-performance IC TELECOM INTERFACE, encapsulated in a 176TQFP package. Designed to enhance communication infrastructures, this integrated circuit provides robust interfacing solutions for high-speed data transmission and reception. The Telecom MaxLinear XRT75L04DIV-F is engineered to meet the rigorous demands of modern telecom networks, offering reliability and efficiency which are vital for mass deployment in business markets. Its versatile applications make it an ideal choice for manufacturers looking to integrate sophisticated telecom functionalities into their systems.

XRT75L04DIV-F Features

The XRT75L04DIV-F boasts a suite of features designed for superior telecom interface performance. Key attributes include its compatibility with multiple data rates, which allows for flexible deployment across various telecom standards. Furthermore, its high integration level reduces system complexity and enhances reliability, while the 176TQFP packaging ensures a compact footprint suitable for densely packed electronic assemblies.

XRT75L04DIV-F Applications

  • Telecommunication Networks: Integral in enabling robust data handling and transfer capabilities within core network infrastructure.
  • Broadband Communication Systems: Supports high-speed data exchange, essential for broadband systems including fiber optics and cable networks.
  • Wireless Base Stations: Facilitates reliable signal processing and interfacing, crucial for maintaining high-efficiency wireless communication links.
  • Satellite Communications: Utilized in satellite modems and transceivers to ensure effective communication between ground stations and orbiting satellites.
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