XPC850VR50BU

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

RAM Size :

8kB

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Supply Voltage-Max (Vsup) :

3.465V

Number of Terminations :

256

Min Operating Temperature :

0°C

Supply Voltage :

3.3V

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Length :

23mm

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Format :

FIXED POINT

Boundary Scan :

yes

Terminal Form :

Ball

Width :

23mm

Integrated Cache :

yes

Number of Cores :

1

Address Bus Width :

26

Height Seated (Max) :

2.35mm

Terminal Position :

BOTTOM

RoHS Status :

RoHS Compliant

Low Power Mode :

yes

Time@Peak Reflow Temperature-Max (s) :

30

Lead Free :

Lead Free

Halogen Free :

Not Halogen Free

Pin Count :

256

JESD-609 Code :

e1

Frequency :

50MHz

Number of Pins :

256

Peak Reflow Temperature (Cel) :

245

Surface Mount :

yes

External Data Bus Width :

32

Qualification Status :

Not Qualified

Bit Size :

32

Max Operating Temperature :

95°C

Core Architecture :

PowerPC