XPC850SRZT80BU

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Frequency :

80MHz

Surface Mount :

yes

Terminal Position :

BOTTOM

External Data Bus Width :

32

Supply Voltage :

3.3V

Max Operating Temperature :

95°C

Lead Free :

Contains Lead

Halogen Free :

Not Halogen Free

Min Operating Temperature :

0°C

Peak Reflow Temperature (Cel) :

220

Integrated Cache :

yes

Width :

23mm

Low Power Mode :

yes

Terminal Finish :

TIN LEAD

Package / Case :

BGA

Supply Voltage-Max (Vsup) :

3.465V

Number of Cores :

1

Address Bus Width :

26

Power Supplies :

3.3V

Number of Terminations :

256

Qualification Status :

Not Qualified

Height Seated (Max) :

2.35mm

Terminal Form :

Ball

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Time@Peak Reflow Temperature-Max (s) :

30

JESD-609 Code :

e0

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Pin Count :

256

Length :

23mm

RoHS Status :

RoHS Compliant

Bit Size :

32

Boundary Scan :

yes

Format :

FIXED POINT