XPC850DEZT66BU

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Reach Compliance Code :

not_compliant

Integrated Cache :

yes

Peak Reflow Temperature (Cel) :

220

Halogen Free :

Not Halogen Free

Number of Terminations :

256

Max Operating Temperature :

95°C

Supply Voltage :

3.3V

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Length :

23mm

Low Power Mode :

yes

Boundary Scan :

yes

Min Operating Temperature :

0°C

Terminal Finish :

TIN LEAD

RoHS Status :

Non-RoHS Compliant

External Data Bus Width :

32

Number of Cores :

1

Surface Mount :

yes

JESD-609 Code :

e0

Address Bus Width :

26

Lead Free :

Contains Lead

Terminal Form :

Ball

Package / Case :

BGA

Qualification Status :

Not Qualified

Pin Count :

256

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Frequency :

66MHz

Bit Size :

32

Width :

23mm

Height Seated (Max) :

2.35mm

Terminal Position :

BOTTOM

Format :

FIXED POINT

Time@Peak Reflow Temperature-Max (s) :

30

Supply Voltage-Max (Vsup) :

3.465V

Power Supplies :

3.3V