XPC850DEVR50BU

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Max Operating Temperature :

95°C

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Lead Free :

Lead Free

Qualification Status :

Not Qualified

Bit Size :

32

Terminal Form :

Ball

Integrated Cache :

yes

Data Bus Width :

32b

Format :

FIXED POINT

Terminal Position :

BOTTOM

Surface Mount :

yes

Package / Case :

BGA

JESD-609 Code :

e1

Peak Reflow Temperature (Cel) :

260

Supply Voltage :

3.3V

Number of Cores :

1

Boundary Scan :

yes

Pin Count :

256

Number of Terminations :

256

Halogen Free :

Not Halogen Free

Time@Peak Reflow Temperature-Max (s) :

40

RoHS Status :

RoHS Compliant

Frequency :

50MHz

Length :

23mm

Address Bus Width :

26

Supply Voltage-Max (Vsup) :

3.465V

Min Operating Temperature :

0°C

Height Seated (Max) :

2.35mm

Number of Pins :

256

Low Power Mode :

yes

Frequency (Max) :

50MHz