XPC850CVR50BU

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Width :

23mm

Terminal Position :

BOTTOM

Surface Mount :

yes

RoHS Status :

RoHS Compliant

Number of Terminations :

256

Integrated Cache :

yes

Bit Size :

32

JESD-609 Code :

e1

Format :

FIXED POINT

Peak Reflow Temperature (Cel) :

220

Number of Cores :

1

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Max Operating Temperature :

95°C

Supply Voltage-Max (Vsup) :

3.465V

Qualification Status :

Not Qualified

Low Power Mode :

yes

Core Architecture :

PowerPC

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Time@Peak Reflow Temperature-Max (s) :

30

Supply Voltage :

3.3V

Pin Count :

256

Address Bus Width :

26

Lead Free :

Lead Free

Halogen Free :

Not Halogen Free

External Data Bus Width :

32

Frequency :

50MHz

Boundary Scan :

yes

Length :

23mm

Number of Pins :

256

Terminal Form :

Ball

Height Seated (Max) :

2.35mm

Min Operating Temperature :

-40°C