XL208-256-FB236-I10

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Mfr.Part #
XL208-256-FB236-I10
Manufacturer
XMOS
Package / Case
236-LFBGA
Datasheet
Download
Description
IC MCU 32BIT ROMLESS 236FBGA
Stock
35,451
In Stock :
35,451

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Manufacturer :
XMOS
Product Category :
Microcontrollers
Core Size :
32-Bit 8-Core
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Core Processor :
XCore
Published :
2015
Speed :
1000MIPS
Oscillator Type :
External
Min Operating Temperature :
-40°C
Factory Lead Time :
12 Weeks
Operating Temperature :
-40°C~85°C TA
Supplier Device Package :
236-FBGA (10x10)
Number of I/O :
128
Series :
XL
Package / Case :
236-LFBGA
Memory Type :
ROMless
Voltage - Supply (Vcc/Vdd) :
0.95V~3.6V
Packaging :
Tray
Number of Pins :
236
Mounting Type :
Surface Mount
Core Architecture :
XCore
RoHS Status :
ROHS3 Compliant
Program Memory Type :
ROMless
RAM Size :
256K x 8
Max Operating Temperature :
85°C
Introducing Microcontrollers XMOS XL208-256-FB236-I10 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~85°C TA, Package / Case:236-LFBGA, Number of Pins:236, Mounting Type:Surface Mount, XL208-256-FB236-I10 pinout, XL208-256-FB236-I10 datasheet PDF, XL208-256-FB236-I10 amp .Beyond Microcontrollers XMOS XL208-256-FB236-I10 ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

XMOS XL208-256-FB236-I10


Microcontrollers XMOS XL208-256-FB236-I10 Overview

The Microcontrollers XMOS XL208-256-FB236-I10 is a cutting-edge microcontroller unit (MCU) that caters to demanding embedded applications. Designed by XMOS, renowned for its innovative approach in semiconductor development, this 32-bit MCU is built on a ROMless platform, allowing designers to implement custom firmware tailored to specific requirements. The 236-pin FBGA (Fine-Pitch Ball Grid Array) package ensures a compact footprint while providing ample I/O capabilities for complex digital and analog integrations. This MCU is particularly suitable for industries looking to leverage advanced processing capabilities within restricted space conditions, aiming for high scalability and flexibility in system design.

XL208-256-FB236-I10 Features

The XL208-256-FB236-I10 by XMOS stands out with its robust feature set designed to support a wide range of applications. Key features include a high-performance 32-bit processing core, extensive I/O options through its 236-pin FBGA packaging, and a ROMless architecture that allows for maximum customization in firmware deployment. This flexibility makes it an ideal choice for developers looking for a versatile and powerful solution that can be tailored to meet specific operational requirements.

XL208-256-FB236-I10 Applications

  • Advanced Audio Systems: The MCU's high processing capabilities enable it to handle complex audio processing tasks, making it ideal for high-end audio conferencing systems, professional audio equipment, and sophisticated noise cancellation modules.
  • Industrial Automation: With robust I/O options, this MCU can manage multiple sensors and actuators in automated manufacturing lines, enhancing process efficiency and reliability.
  • Consumer Electronics: Utilized in devices like smart home systems and advanced gaming consoles, the XL208-256-FB236-I10 supports rich user interfaces and real-time processing needs.
  • Automotive Applications: Suitable for in-vehicle systems, including infotainment and advanced driver-assistance systems (ADAS), where reliable and rapid processing is critical.
  • IoT Devices: The ability to integrate with various sensors and connectivity modules makes this MCU an excellent choice for Internet of Things devices, requiring efficient power management and connectivity.
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