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    Mfr.Part #
    XCZU19EG-1FFVB1517I
    Manufacturer
    AMD Xilinx
    Package / Case
    1517-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A53 1517FCBGA
    Stock
    10,776
    In Stock ：
    10,776

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Factory Lead Time :
    11 Weeks
    RoHS Status :
    ROHS3 Compliant
    Operating Temperature :
    -40°C~100°C TJ
    Series :
    Zynq® UltraScale+™ MPSoC EG
    Packaging :
    Tray
    Peripherals :
    DMA, WDT
    Published :
    2016
    RAM Size :
    256KB
    HTS Code :
    8542.31.00.01
    Package / Case :
    1517-BBGA, FCBGA
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
    Core Processor :
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    Speed :
    500MHz, 600MHz, 1.2GHz
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    Number of I/O :
    644
    Architecture :
    MCU, FPGA
    Introducing System On Chip (SoC) AMD Xilinx XCZU19EG-1FFVB1517I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature：-40°C~100°C TJ, Package / Case：1517-BBGA, FCBGA, XCZU19EG-1FFVB1517I pinout, XCZU19EG-1FFVB1517I datasheet PDF, XCZU19EG-1FFVB1517I amp .Beyond System On Chip (SoC) AMD Xilinx XCZU19EG-1FFVB1517I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU19EG-1FFVB1517I


    -40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 644 I/O

    This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


    Based on the core processor(s) Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2, this SoC has been developed.The manufacturer assigns this system on a chip with a 1517-BBGA, FCBGA package as per the manufacturer's specifications.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the Zynq® UltraScale+™ MPSoC EG series of system on a chips.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 644 I/Os.

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


    256KB RAM.
    Built on MCU, FPGA.


    There are a lot of Xilinx Inc.


    XCZU19EG-1FFVB1517I System On Chip (SoC) applications.


    • Measurement testers
    • Networked sensors
    • Robotics
    • Central alarm system
    • Smart appliances
    • Industrial automation devices
    • Sports
    • Fitness
    • Healthcare
    • Medical
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