XCVU3P-3FFVC1517E
- Mfr.Part #
- XCVU3P-3FFVC1517E
- Manufacturer
- AMD Xilinx
- Package / Case
- 1517-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 520 I/O 1517FCBGA
- Stock
- 40,343
- In Stock :
- 40,343
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Operating Temperature :
- 0°C~100°C TJ
- Voltage - Supply :
- 0.873V~0.927V
- Factory Lead Time :
- 11 Weeks
- HTS Code :
- 8542.39.00.01
- Mounting Type :
- Surface Mount
- RoHS Status :
- ROHS3 Compliant
- Package / Case :
- 1517-BBGA, FCBGA
- Total RAM Bits :
- 118067200
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Number of I/O :
- 520
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells :
- 862050
- Number of LABs/CLBs :
- 49260
- Series :
- Virtex® UltraScale+™
- Packaging :
- Tray
- Datasheets
- XCVU3P-3FFVC1517E

FPGAs AMD Xilinx XCVU3P-3FFVC1517E Overview
The FPGAs AMD Xilinx XCVU3P-3FFVC1517E is a highly advanced field-programmable gate array designed to meet the rigorous demands of modern digital processing. Engineered by AMD Xilinx, a leader in FPGA technology, this device encapsulates top-tier flexibility and performance in system integration. Ideal for applications requiring high-speed data processing and intricate algorithm executions, this FPGA is encapsulated in a 1517-pin flip-chip ball grid array (FCBGA) package, providing a robust interface for a wide range of uses. The high I/O count of 520 makes it exceptionally versatile for complex digital circuits, enhancing system performance and reliability in critical applications.
XCVU3P-3FFVC1517E Features
This FPGA model boasts a robust suite of features designed for scalability and high performance. It supports a wide array of applications thanks to its versatile 520 I/O ports, which are crucial for handling multiple inputs and outputs simultaneously. The 1517FCBGA packaging ensures that it can be integrated into various hardware settings, maintaining robustness and enhancing thermal management. The integration of high-end technology allows for superior signal integrity and lower latency in processing complex operations.
XCVU3P-3FFVC1517E Applications
- Data Centers: Utilized for managing vast amounts of data transactions, the FPGA's high I/O interface ensures efficient data flow and processing capabilities essential in modern data centers.
- Telecommunications: In telecom, this FPGA helps in handling complex signal processing tasks, improving bandwidth and reducing latency for better network reliability and performance.
- Automotive Systems: Applied in driver assistance systems, the XCVU3P-3FFVC1517E manages sensor inputs and real-time decision making, enhancing vehicular safety and functionality.
- Aerospace and Defense: Crucial for applications requiring high levels of data encryption and real-time processing for navigation and control systems.
- Video Processing: This FPGA is used in high-resolution video processing, supporting the demands of encoding, decoding, and real-time streaming applications.
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