XCVU3P-3FFVC1517E

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Mfr.Part #
XCVU3P-3FFVC1517E
Manufacturer
AMD Xilinx
Package / Case
1517-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 520 I/O 1517FCBGA
Stock
40,343
In Stock :
40,343

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Operating Temperature :
0°C~100°C TJ
Voltage - Supply :
0.873V~0.927V
Factory Lead Time :
11 Weeks
HTS Code :
8542.39.00.01
Mounting Type :
Surface Mount
RoHS Status :
ROHS3 Compliant
Package / Case :
1517-BBGA, FCBGA
Total RAM Bits :
118067200
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Number of I/O :
520
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells :
862050
Number of LABs/CLBs :
49260
Series :
Virtex® UltraScale+™
Packaging :
Tray
Datasheets
XCVU3P-3FFVC1517E
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU3P-3FFVC1517E from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~100°C TJ, Mounting Type:Surface Mount, Package / Case:1517-BBGA, FCBGA, XCVU3P-3FFVC1517E pinout, XCVU3P-3FFVC1517E datasheet PDF, XCVU3P-3FFVC1517E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU3P-3FFVC1517E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCVU3P-3FFVC1517E


FPGAs AMD Xilinx XCVU3P-3FFVC1517E Overview

The FPGAs AMD Xilinx XCVU3P-3FFVC1517E is a highly advanced field-programmable gate array designed to meet the rigorous demands of modern digital processing. Engineered by AMD Xilinx, a leader in FPGA technology, this device encapsulates top-tier flexibility and performance in system integration. Ideal for applications requiring high-speed data processing and intricate algorithm executions, this FPGA is encapsulated in a 1517-pin flip-chip ball grid array (FCBGA) package, providing a robust interface for a wide range of uses. The high I/O count of 520 makes it exceptionally versatile for complex digital circuits, enhancing system performance and reliability in critical applications.

XCVU3P-3FFVC1517E Features

This FPGA model boasts a robust suite of features designed for scalability and high performance. It supports a wide array of applications thanks to its versatile 520 I/O ports, which are crucial for handling multiple inputs and outputs simultaneously. The 1517FCBGA packaging ensures that it can be integrated into various hardware settings, maintaining robustness and enhancing thermal management. The integration of high-end technology allows for superior signal integrity and lower latency in processing complex operations.

XCVU3P-3FFVC1517E Applications

  • Data Centers: Utilized for managing vast amounts of data transactions, the FPGA's high I/O interface ensures efficient data flow and processing capabilities essential in modern data centers.
  • Telecommunications: In telecom, this FPGA helps in handling complex signal processing tasks, improving bandwidth and reducing latency for better network reliability and performance.
  • Automotive Systems: Applied in driver assistance systems, the XCVU3P-3FFVC1517E manages sensor inputs and real-time decision making, enhancing vehicular safety and functionality.
  • Aerospace and Defense: Crucial for applications requiring high levels of data encryption and real-time processing for navigation and control systems.
  • Video Processing: This FPGA is used in high-resolution video processing, supporting the demands of encoding, decoding, and real-time streaming applications.
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