XCVU23P-2FSVJ1760I

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Mfr.Part #
XCVU23P-2FSVJ1760I
Manufacturer
AMD Xilinx
Package / Case
1152-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA VIRTEX-UP 1760FCBGA
Stock
16,533
In Stock :
16,533

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of LABs/CLBs :
10377
Package :
Tray
Base Part Number :
5AGZME1
Series :
Arria V GZ
Operating Temperature :
0°C ~ 85°C (TJ)
Voltage - Supply :
0.82 V ~ 0.88 V
Package / Case :
1152-BBGA, FCBGA
Number of I/O :
414
Total RAM Bits :
15282176
Number of Logic Elements/Cells :
220000
Product Status :
Active
Mounting Type :
Surface Mount
Supplier Device Package :
1152-FBGA (35x35)
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU23P-2FSVJ1760I from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:5AGZME1, Operating Temperature:0°C ~ 85°C (TJ), Package / Case:1152-BBGA, FCBGA, Mounting Type:Surface Mount, XCVU23P-2FSVJ1760I pinout, XCVU23P-2FSVJ1760I datasheet PDF, XCVU23P-2FSVJ1760I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU23P-2FSVJ1760I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCVU23P-2FSVJ1760I


FPGAs AMD Xilinx XCVU23P-2FSVJ1760I Overview

The FPGAs AMD Xilinx XCVU23P-2FSVJ1760I is a high-performance, feature-rich FPGA from AMD Xilinx's acclaimed Virtex UltraScale+ series. This integrated circuit is designed to deliver exceptional levels of integration and operational efficiency in a compact 1760-pin flip-chip ball grid array (FCBGA) package. Its advanced architecture enables users to achieve new heights in complex algorithm implementation and system integration, making it an ideal solution for demanding applications that require robust data processing and high-speed connectivity. The use of this FPGA can significantly reduce the time to market for high-performance computing, networking, and telecommunications equipment.

XCVU23P-2FSVJ1760I Features

The XCVU23P-2FSVJ1760I boasts numerous features that make it stand out in the FPGA market. Its key attributes include a high-density logic cell configuration, advanced memory technology, and superior signal processing capabilities. Additionally, this FPGA supports a wide range of I/O standards and protocols, ensuring compatibility with various existing systems and ease of integration into new designs. With its robust thermal management and energy efficiency, the XCVU23P-2FSVJ1760I is designed for sustained performance under challenging conditions.

XCVU23P-2FSVJ1760I Applications

  • Data Centers

    This FPGA is utilized in data center applications to optimize network traffic flow and data processing, enhancing overall efficiency and reducing latency in cloud computing environments.

  • High-Performance Computing (HPC)

    In HPC systems, the XCVU23P-2FSVJ1760I accelerates computational tasks, facilitating faster processing of complex simulations and analytics in scientific and engineering sectors.

  • 5G Infrastructure

    The device is critical in 5G infrastructure, where it processes high-volume data and supports the deployment of next-generation telecommunications networks with its high-speed signal processing capabilities.

  • Video Streaming and Processing

    Utilized in video processing applications, the FPGA allows for real-time video encoding and decoding, supporting high-definition video streaming services.

  • Aerospace and Defense

    For aerospace and defense applications, the XCVU23P-2FSVJ1760I ensures reliability and performance in systems requiring high levels of data encryption and secure communications.

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