XCVC1902-2MSEVSVD1760
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- Mfr.Part #
- XCVC1902-2MSEVSVD1760
- Manufacturer
- AMD Xilinx
- Package / Case
- 1760-BFBGA, FCBGA
- Datasheet
- Download
- Description
- IC VERSAL AICORE FPGA 1760BGA
- Stock
- 45,803
- In Stock ：
- 45,803
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Height :
- 1.4 mm
- RoHS :
- Details
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Peripherals :
- DDR, DMA, PCIe
- Number of I/O :
- 692
- Maximum Operating Temperature :
- + 200 C
- Package :
- Tray
- Packaging :
- Bulk
- Supplier Device Package :
- 1760-FCBGA (40x40)
- Power Rating :
- 18 mW
- Flash Size :
- -
- Resistance :
- 30 kOhms
- Manufacturer :
- EPCOS / TDK
- RAM Size :
- 256KB
- Subcategory :
- Thermistors
- Lead Diameter :
- 0.15 mm
- Product Type :
- NTC Thermistors
- Speed :
- 600MHz, 1.4GHz
- Operating Temperature :
- 0°C ~ 100°C (TJ)
- Mounting Style :
- PCB Mount
- Series :
- B57540G
- Product Status :
- Active
- Primary Attributes :
- Versal™ AI Core FPGA, 1.9M Logic Cells
- Type :
- NTC
- Minimum Operating Temperature :
- - 55 C
- Termination Style :
- Radial
- Core Processor :
- Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
- Brand :
- EPCOS / TDK
- Width :
- 0.8 mm
- Package / Case :
- 1760-BFBGA, FCBGA
- Tolerance :
- 1 %
- Product Category :
- NTC Thermistors
- Diameter :
- 0.8 mm
- Architecture :
- MPU, FPGA
- Datasheets
- XCVC1902-2MSEVSVD1760
0°C ~ 100°C (TJ) System On Chip B57540G Series 692 I/O
This SoC is built on Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ core processor(s).
There are Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ core processors in this SoC.This system on a chip is packaged as 1760-BFBGA, FCBGA by the manufacturer.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MPU, FPGA method.The B57540G series contains this system on chip SoC.It is expected that this SoC meaning will operate at 0°C ~ 100°C (TJ) on average.There is one thing to note about this SoC security: it combines Versal™ AI Core FPGA, 1.9M Logic Cells.In the state-of-the-art Bulk package, this SoC system on a chip is housed.This SoC part has a total of 692 I/Os.As any high-quality Thermistors, it is a system on a chip of outstanding capabilities.The flash is set to -.
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ processor.
256KB RAM.
Built on MPU, FPGA.
- extended flash.
There are a lot of Xilinx
XCVC1902-2MSEVSVD1760 System On Chip (SoC) applications.
- Industrial transport
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
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