XCVC1902-1MSEVSVD1760

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Mfr.Part #
XCVC1902-1MSEVSVD1760
Manufacturer
AMD Xilinx
Package / Case
1760-BFBGA, FCBGA
Datasheet
Download
Description
IC VERSAL AICORE FPGA 1760BGA
Stock
29,439
In Stock :
29,439

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Speed :
600MHz, 1.3GHz
Operating Supply Voltage :
800 mV
Supplier Device Package :
1760-FCBGA (40x40)
RoHS :
Details
Architecture :
MPU, FPGA
Package :
Tray
Maximum Operating Temperature :
+ 100 C
Package / Case :
1760-BFBGA, FCBGA
Operating Temperature :
0°C ~ 100°C (TJ)
Product Status :
Active
Number of I/O :
692
RAM Size :
256KB
Primary Attributes :
Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity :
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Flash Size :
-
Series :
Versal™ AI Core
Minimum Operating Temperature :
0 C
Peripherals :
DDR, DMA, PCIe
Core Processor :
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Introducing System On Chip (SoC) AMD Xilinx XCVC1902-1MSEVSVD1760 from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:1760-BFBGA, FCBGA, Operating Temperature:0°C ~ 100°C (TJ), XCVC1902-1MSEVSVD1760 pinout, XCVC1902-1MSEVSVD1760 datasheet PDF, XCVC1902-1MSEVSVD1760 amp .Beyond System On Chip (SoC) AMD Xilinx XCVC1902-1MSEVSVD1760 ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCVC1902-1MSEVSVD1760


0°C ~ 100°C (TJ) System On Chip Versal™ AI Core Series 692 I/O

This SoC is built on Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ core processor(s).


Based on the core processor(s) Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™, this SoC has been developed.The manufacturer assigns this system on a chip with a 1760-BFBGA, FCBGA package as per the manufacturer's specifications.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MPU, FPGA technique.It is part of the Versal™ AI Core series of system on a chips.It is recommended that this SoC meaning be operated at 0°C ~ 100°C (TJ) on an average.As one of the most important things to note is that this SoC security combines Versal™ AI Core FPGA, 1.9M Logic Cells together.An integral part of this SoC consists of a total of 692 I/Os.As for its flash size, it is -.

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ processor.


256KB RAM.
Built on MPU, FPGA.
- extended flash.


There are a lot of Xilinx


XCVC1902-1MSEVSVD1760 System On Chip (SoC) applications.


  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
  • Medical
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