XCVC1902-1MSEVSVA2197

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Mfr.Part #
XCVC1902-1MSEVSVA2197
Manufacturer
AMD Xilinx
Package / Case
2197-BFBGA, FCBGA
Datasheet
Download
Description
IC VERSAL AICORE FPGA 2197BGA
Stock
16,304
In Stock :
16,304

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Peripherals :
DDR, DMA, PCIe
Number of I/O :
770
Minimum Operating Temperature :
0 C
Operating Temperature :
0°C ~ 100°C (TJ)
Product Status :
Active
Package :
Tray
Connectivity :
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Package / Case :
2197-BFBGA, FCBGA
Supplier Device Package :
2197-FCBGA (45x45)
Flash Size :
-
Core Processor :
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes :
Versal™ AI Core FPGA, 1.9M Logic Cells
Architecture :
MPU, FPGA
Maximum Operating Temperature :
+ 100 C
Operating Supply Voltage :
800 mV
RoHS :
Details
RAM Size :
256KB
Series :
Versal™ AI Core
Speed :
600MHz, 1.3GHz
Introducing System On Chip (SoC) AMD Xilinx XCVC1902-1MSEVSVA2197 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C ~ 100°C (TJ), Package / Case:2197-BFBGA, FCBGA, XCVC1902-1MSEVSVA2197 pinout, XCVC1902-1MSEVSVA2197 datasheet PDF, XCVC1902-1MSEVSVA2197 amp .Beyond System On Chip (SoC) AMD Xilinx XCVC1902-1MSEVSVA2197 ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCVC1902-1MSEVSVA2197


0°C ~ 100°C (TJ) System On Chip Versal™ AI Core Series 770 I/O

This SoC is built on Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ core processor(s).


Based on the core processor(s) Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™, this SoC has been developed.The manufacturer assigns this system on a chip with a 2197-BFBGA, FCBGA package as per the manufacturer's specifications.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MPU, FPGA technique.It is part of the Versal™ AI Core series of system on a chips.It is recommended that this SoC meaning be operated at 0°C ~ 100°C (TJ) on an average.As one of the most important things to note is that this SoC security combines Versal™ AI Core FPGA, 1.9M Logic Cells together.An integral part of this SoC consists of a total of 770 I/Os.As for its flash size, it is -.

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ processor.


256KB RAM.
Built on MPU, FPGA.
- extended flash.


There are a lot of Xilinx


XCVC1902-1MSEVSVA2197 System On Chip (SoC) applications.


  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
  • Medical
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