XCVC1902-1LSEVSVD1760

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Mfr.Part #
XCVC1902-1LSEVSVD1760
Manufacturer
AMD Xilinx
Package / Case
1760-BFBGA, FCBGA
Datasheet
Download
Description
IC VERSAL AICORE FPGA 1760BGA
Stock
23,845
In Stock :
23,845

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Connectivity :
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Flash Size :
-
Operating Supply Voltage :
700 mV
RoHS :
Details
Architecture :
MPU, FPGA
Speed :
400MHz, 1GHz
Primary Attributes :
Versal™ AI Core FPGA, 1.9M Logic Cells
Core Processor :
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Maximum Operating Temperature :
+ 100 C
Package :
Tray
RAM Size :
256KB
Series :
Versal™ AI Core
Peripherals :
DDR, DMA, PCIe
Number of I/O :
692
Operating Temperature :
0°C ~ 100°C (TJ)
Package / Case :
1760-BFBGA, FCBGA
Supplier Device Package :
1760-FCBGA (40x40)
Minimum Operating Temperature :
0 C
Product Status :
Active
Introducing System On Chip (SoC) AMD Xilinx XCVC1902-1LSEVSVD1760 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C ~ 100°C (TJ), Package / Case:1760-BFBGA, FCBGA, XCVC1902-1LSEVSVD1760 pinout, XCVC1902-1LSEVSVD1760 datasheet PDF, XCVC1902-1LSEVSVD1760 amp .Beyond System On Chip (SoC) AMD Xilinx XCVC1902-1LSEVSVD1760 ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCVC1902-1LSEVSVD1760


0°C ~ 100°C (TJ) System On Chip Versal™ AI Core Series 692 I/O

This SoC is built on Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ core processor(s).


On this SoC, there is Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ core processor.Assigned with the package 1760-BFBGA, FCBGA, this system on a chip comes from the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MPU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the Versal™ AI Core series.Temperatures should be 0°C ~ 100°C (TJ) on average for this SoC meaning.In addition, this SoC security combines Versal™ AI Core FPGA, 1.9M Logic Cells.As a whole, this SoC part includes 692 I/Os.There is a flash of - on it.

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ processor.


256KB RAM.
Built on MPU, FPGA.
- extended flash.


There are a lot of Xilinx


XCVC1902-1LSEVSVD1760 System On Chip (SoC) applications.


  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
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