XCVC1802-2MLEVSVD1760

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Mfr.Part #
XCVC1802-2MLEVSVD1760
Manufacturer
AMD Xilinx
Package / Case
1760-BFBGA, FCBGA
Datasheet
Download
Description
IC VERSAL AICORE FPGA 1760BGA
Stock
31,220
In Stock :
31,220

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Mounting Style :
PCB Mount
Supplier Device Package :
1760-FCBGA (40x40)
Connectivity :
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Packaging :
Bulk
Product Category :
NTC Thermistors
Flash Size :
-
Speed :
600MHz, 1.4GHz
Series :
M / C / T
Minimum Operating Temperature :
- 40 C
Primary Attributes :
Versal™ AI Core FPGA, 1.5M Logic Cells
Peripherals :
DDR, DMA, PCIe
Operating Temperature :
0°C ~ 100°C (TJ)
Package :
Tray
Resistance :
30 kOhms
Architecture :
MPU, FPGA
Termination Style :
Radial
Core Processor :
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Number of I/O :
692
Manufacturer :
Vishay
Subcategory :
Thermistors
Type :
NTC
Product Type :
NTC Thermistors
Maximum Operating Temperature :
+ 125 C
Tolerance :
0.2 %
Brand :
Vishay / Dale
RAM Size :
256KB
Product Status :
Active
RoHS :
N
Package / Case :
1760-BFBGA, FCBGA
Introducing System On Chip (SoC) AMD Xilinx XCVC1802-2MLEVSVD1760 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C ~ 100°C (TJ), Type:NTC, Package / Case:1760-BFBGA, FCBGA, XCVC1802-2MLEVSVD1760 pinout, XCVC1802-2MLEVSVD1760 datasheet PDF, XCVC1802-2MLEVSVD1760 amp .Beyond System On Chip (SoC) AMD Xilinx XCVC1802-2MLEVSVD1760 ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCVC1802-2MLEVSVD1760


0°C ~ 100°C (TJ) System On Chip M / C / T Series 692 I/O

This SoC is built on Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ core processor(s).


A core processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ is used to build this SoC.Its package is 1760-BFBGA, FCBGA.A 256KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MPU, FPGA technique.A system on chip SoC of this type belongs to the M / C / T series.For this SoC meaning, the average operating temperature should be 0°C ~ 100°C (TJ).A key point to note is that this SoC security combines Versal™ AI Core FPGA, 1.5M Logic Cells.It comes in a state-of-the-art Bulk package.Total I/Os on this SoC part are 692.In the same way that other high-quality Thermistors will do, it is also capable of providing outstanding performance.There is a flash of -.

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ processor.


256KB RAM.
Built on MPU, FPGA.
- extended flash.


There are a lot of Xilinx


XCVC1802-2MLEVSVD1760 System On Chip (SoC) applications.


  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
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